Resources Contact Us Home
Method relating to anodic bonding

Image Number 4 for United States Patent #6951797.

The present invention relates to a method of bonding a first member (110, 210, 130, 230, 410, 430, 510, 530, 610) to a second silicon member (120, 220, 420a, 420b, 600) through anodic bonding. The method comprises the steps of selectively depositing on said first member bondable sections (170a, 170b, 270, 470a, 470b, 470c, 570, 620) before bringing said first and second members together for anodic bonding.

  Recently Added Patents
Tranverse in-core probe monitoring and calibration device for nuclear power plants, and method thereof
Methods for non-linear image blending, adjustment and display
Undercabinet plug-in mount
Artificial engine sound control unit, approaching vehicle audible system, and electric vehicle having them
System and method for dynamic quality-of-service-based billing in a peer-to-peer network
MOS resistor apparatus and methods
  Randomly Featured Patents
Electrical connector having elastic terminals with contacts located at the same level
Device for holding pages
Row-diagonal parity technique for enabling efficient recovery from double failures in a storage array
Magnetic determination of position and orientation
Shelf and support assembly
Methods for controlling ocular hypertension with angiostatic steroids
Vehicle remote control and air treatment system and associated methods
Method of preparing a concentrated solution of a polyglucosamine
Fine circuit pattern drawing apparatus and method
Method and system for customizing a user interface to an on-demand database service