Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method relating to anodic bonding










Image Number 4 for United States Patent #6951797.

The present invention relates to a method of bonding a first member (110, 210, 130, 230, 410, 430, 510, 530, 610) to a second silicon member (120, 220, 420a, 420b, 600) through anodic bonding. The method comprises the steps of selectively depositing on said first member bondable sections (170a, 170b, 270, 470a, 470b, 470c, 570, 620) before bringing said first and second members together for anodic bonding.








 
 
  Recently Added Patents
Image processing system, image processing apparatus, control method for image processing apparatus, and storage medium
Method, apparatus, computer program, and computer readable storage media for controlling the insertion of tab sheets into a print job
Dynamic association and disassociation of threads to device functions based on requestor identification
Spatula
Method of manufacturing crystalline silicon solar cells with improved surface passivation
Visual model importation
Integrated circuit with electromagnetic intrachip communication and methods for use therewith
  Randomly Featured Patents
Molded play station connector
Writing doll
Table
Automatic tool changer for machine tools
Expandable irrigation signal
Method of enhancing the mobilization of hematopoietic stem cells using TAT-HOXB4H
System and method for managing and authenticating services via service principal names
Apparatus and method for producing 3D sound
Firmware repository for MFP devices
Extraction of hemodynamic pulse pressure from fluid and myocardial accelerations