Resources Contact Us Home
Method relating to anodic bonding

Image Number 4 for United States Patent #6951797.

The present invention relates to a method of bonding a first member (110, 210, 130, 230, 410, 430, 510, 530, 610) to a second silicon member (120, 220, 420a, 420b, 600) through anodic bonding. The method comprises the steps of selectively depositing on said first member bondable sections (170a, 170b, 270, 470a, 470b, 470c, 570, 620) before bringing said first and second members together for anodic bonding.

  Recently Added Patents
Method for controlling a motor
Image processing apparatus and image processing method
Systems and methods for building axes, co-axes and paleo-geographic coordinates related to a stratified geological volume
Inductive antenna coupling
Method for media access controlling and system and method for channel time reservation in distributed wireless personal area network
Bit error mitigation
Using rule induction to identify emerging trends in unstructured text streams
  Randomly Featured Patents
Digital photo album with image modification and internal printing
Bed of a scanner for an x-ray tomography diagnosis apparatus
Container covering system
Urinary incontinence device applicator
Stackable container for fluids
Pressure balanced hydraulic coupling with metal seals
Rotational rate sensor
Ink jet print head and ink jet printer with cover body encasing and aligning head chips
Aromatic sulfonic acids, amines, and nitrophenols in combination with nitroxyl radical-containing compounds or C-nitrosanilines as polymerization inhibitors