Resources Contact Us Home
Method relating to anodic bonding

Image Number 4 for United States Patent #6951797.

The present invention relates to a method of bonding a first member (110, 210, 130, 230, 410, 430, 510, 530, 610) to a second silicon member (120, 220, 420a, 420b, 600) through anodic bonding. The method comprises the steps of selectively depositing on said first member bondable sections (170a, 170b, 270, 470a, 470b, 470c, 570, 620) before bringing said first and second members together for anodic bonding.

  Recently Added Patents
Catheter with multiple electrode assemblies for use at or near tubular regions of the heart
Organic light emitting device connection methods
Method for accessing wireless network
Vehicle grille
Method and apparatus for policy-based network access control with arbitrary network access control frameworks
Display control device, display control method, and touchpad input system
Power collecting device, power measuring device, and power collecting method
  Randomly Featured Patents
Single container manufacturing of biological product
Apparatus for granulating metallurgical melt
Support module for mobile advertising displays for sporting arenas
Flat panel monitor combining direct view with overhead projection capability
Method and arrangement for improved positioning
Automatic roll-in take-up reel and multi-color image recording apparatus using the same
Novel crosslinking components containing biuret groups for cationic paint binders
Showerhead unit
Hydrogenated star-shaped polymer