Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method relating to anodic bonding










Image Number 4 for United States Patent #6951797.

The present invention relates to a method of bonding a first member (110, 210, 130, 230, 410, 430, 510, 530, 610) to a second silicon member (120, 220, 420a, 420b, 600) through anodic bonding. The method comprises the steps of selectively depositing on said first member bondable sections (170a, 170b, 270, 470a, 470b, 470c, 570, 620) before bringing said first and second members together for anodic bonding.








 
 
  Recently Added Patents
Lifting apparatus
Base station, relay station, and bandwidth allocation method
Visibility radio cap and network
Simplified algorithm for abnormal situation prevention in load following applications including plugged line diagnostics in a dynamic process
System and method for optimizing teams
Method and apparatus for controllable communication
Locking flange
  Randomly Featured Patents
Method of stabilizing aerosol formulations
Method for production of abrasive composition for use in toothpaste
Enhanced challenge-response
Array prefetch apparatus and method
Rope fastener
Power element protection circuit and semiconductor device incorporating it
Low emission induction heating coil
Digital audio disc player for an automobile
Universal miter saw bench
Adaptive X-ray optics