Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method relating to anodic bonding










Image Number 4 for United States Patent #6951797.

The present invention relates to a method of bonding a first member (110, 210, 130, 230, 410, 430, 510, 530, 610) to a second silicon member (120, 220, 420a, 420b, 600) through anodic bonding. The method comprises the steps of selectively depositing on said first member bondable sections (170a, 170b, 270, 470a, 470b, 470c, 570, 620) before bringing said first and second members together for anodic bonding.








 
 
  Recently Added Patents
Bias voltage generating circuit and switching power supply thereof
Online data conversion technique using a sliding window
Method for producing (meth)acrylic anhydride, method for storing (meth)acrylic anhydride, and method for producing (meth)acrylate
Process for producing polyphenylene ether composition
Uni-directional transient voltage suppressor (TVS)
Monitoring heap in real-time by a mobile agent to assess performance of virtual machine
Apparatus and method for adapted deblocking filtering strength
  Randomly Featured Patents
Processing image data
Electronic equipment housing cooled by natural and forced ventilation
Method for making a commutator
Process and device for coating a support using a crosslinkable silicone composition
Thermosetting resin composition from poly-arylene-oxy-bis-maleimide and polyarylene diamine
Solar and heat pump powered electric forced hot air hydronic furnace
Blended amino functional siloxane release agents for fuser members
Container assembly
Monotube damper
Geolocation estimation method for CDMA terminals based on pilot strength measurements