Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Electronic parts mounting method and device therefor










Image Number 14 for United States Patent #6926796.

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is corrected, the bumps are compressed, and the insulating resin is hardened.








 
 
  Recently Added Patents
Vehicle exterior
Positive electrode active material for nonaqueous electrolyte secondary battery
Power converter with a variable reference voltage and inrush current limiting
Vehicle control apparatus
Image scanning apparatus and image forming apparatus
Phospholipid-based powders for drug delivery
Systems and methods for tracking mobile terrestrial terminals for satellite communications
  Randomly Featured Patents
Semiconductor memory device having improved resistance to alpha particle induced soft errors
Stand-alone self-supporting disposable ghost shaped baking cup
Upstream occlusion detection system
Method and device for determining the fluorescence of a sample and use thereof
Generational real-time garbage collection
Storage subsystem with configurable buffer
Link systems and articulation mechanisms for remote manipulation of surgical or diagnostic tools
Growth stimulant compositions
Current collector device and method of manufacturing same
Element having a nonlinear transmission characteristic