Resources Contact Us Home
Electronic parts mounting method and device therefor

Image Number 14 for United States Patent #6926796.

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is corrected, the bumps are compressed, and the insulating resin is hardened.

  Recently Added Patents
Block polymers and their process of preparation
Downlink scheduling in fractional frequency reuse (FFR) systems
Solar cell with hyperpolarizable absorber
Imaging apparatus, control method thereof, and program
Focus detection device and imaging apparatus having the same
Lighting device with device for regulating the illumination according to the luminance of the illumination field and corresponding use
Electrophotographic photoreceptor and image forming apparatus including the same
  Randomly Featured Patents
Cleanup of wet process phosphoric acid
Method and apparatus for detecting the direction of incidence of electromagnetic radiation
Coolant filter
Hidden volume cushion
Two-source series inverter
Broadcast system with associated data capabilities
Multifrequency antenna matching apparatus with antomatic tuning
Typewriter, printer or the like and ribbon cassette therefor
Hand drill powered mini chain saw
Recombinant blood clotting factors