Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Electronic parts mounting method and device therefor










Image Number 14 for United States Patent #6926796.

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is corrected, the bumps are compressed, and the insulating resin is hardened.








 
 
  Recently Added Patents
Solid-state imaging device, method for manufacturing solid-state imaging device, and electronic apparatus
Network decoys
Apparatus and method of preventing signal delay in display device
Haloalky -substituted amides as insecticides and acaricides
Front cover of an electronic device
Dental composition, kit of parts and use thereof
Adaptive frame scanning scheme for pulsed X-ray imaging
  Randomly Featured Patents
System for generating a wideband signal from a narrowband signal using transmitted speaker-dependent data
Rating method and system for early childhood educational programs
Dental X-ray alignment system
Apparatus for injection molding tire treads
Plastic zoom lens
Firewood rack
Blind detection of packet data control channel
Musical instrument tuning apparatus and method
Slide groove fixing device for use with curtains
Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals