Resources Contact Us Home
Electronic parts mounting method and device therefor

Image Number 14 for United States Patent #6926796.

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is corrected, the bumps are compressed, and the insulating resin is hardened.

  Recently Added Patents
Security arrangements for extended USB protocol stack of a USB host system
Automated gate system
Imaging lens having five lens elements, and electronic apparatus having the same
Method and apparatus for interactive distribution of digital content
3D IC method and device
Messenger bag
Fail-safe upgrading of portable electronic device software
  Randomly Featured Patents
Conversion of oxygenates to hydrocarbons with monolith supported non-zeolitic molecular sieve catalysts
Inverter circuit for inhibiting electricity transmission interference
Double-sided integrated circuit chips
Pallet with paint receptacles
Liquid crystal photo-alignment agent, liquid crystal photo-alignment layer manufactured using the same, and liquid crystal display device including the liquid crystal photo-alignment layer
Toothbrush with movable head sections for enhanced oral care
Injection unit for an injection molding machine
Handheld device having linkage supporter
Method for computational graceful degradation in an audiovisual compression system