Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Electronic parts mounting method and device therefor










Image Number 14 for United States Patent #6926796.

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is corrected, the bumps are compressed, and the insulating resin is hardened.








 
 
  Recently Added Patents
Monitoring agent programs in a distributed computing platform
Organic electroluminescence element
Managing method and apparatus for servicing contents provided by content provider
One-dimensional metal nanostructures
Tread portion of an automobile tire
Semiconductor device and manufacturing method thereof
System and method for dynamic quality-of-service-based billing in a peer-to-peer network
  Randomly Featured Patents
Process and apparatus for the separation of gases
Analogue to digital converter
Impeller shaft seal and lubricator arrangement
Integrated freeze protection and pressure relief valve
Layout method for designing an integrated circuit device by using standard cells
Connector assembly for a stabilizer bar
Robust packet detection, symbol timing, channel length estimation and channel response estimation for wireless systems
Electronic display device
Oximeter sensor with digital memory
Method and apparatus for driving a flashing light systems using substantially square power pulses