Resources Contact Us Home
Electronic parts mounting method and device therefor

Image Number 14 for United States Patent #6926796.

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is corrected, the bumps are compressed, and the insulating resin is hardened.

  Recently Added Patents
Semiconductor device, semiconductor device design method, semiconductor design apparatus, and program
Non-volatile memory cell containing a nano-rail electrode
Sensor chip, sensor cartridge, and analysis apparatus
Shot scent dispenser
Centralized behavioral information system
Method for switching between virtualized and non-virtualized system operation
Chemically bonded carbon nanotube-polymer hybrid and nanocomposite thereof
  Randomly Featured Patents
Method and apparatus for identifying insulin vials
Copolymer coating compositions comprising sulfoalkyl monomeric emulsifier
Piston/slide shoe arrangement
IC card including frame with lateral hole for injecting encapsulating resin
Replacement printer cartridge chip with a microcontroller with an encrypted memory device
Stack microelectronic assemblies
System and method for monitoring physical condition of production well equipment and controlling well production
Telescoping strut shock isolator
Imide functional polyphenols; thermosettable compositions containing same and cured products therefrom
Apparatus for cocking a biopsy device