Resources Contact Us Home
Semiconductor circuit device adaptable to plurality of types of packages

Image Number 16 for United States Patent #6873563.

Data pad regions are arranged in four divided regions of a semiconductor memory chip of a rectangular shape, respectively, and data pads are selectively utilized in each of the four divided regions in accordance with a word structure. Thus, it is possible to implement a semiconductor memory chip capable of being assembled in both a single chip package and a multi chip package.

  Recently Added Patents
Process for brominating unsaturated organic compounds with removal of quaternary ammonium or quaternary phosphonium monochlorides
Reserving a time block in a calendar application to account for a travel time between geographic locations of appointments
Inhibitors of human immunodeficiency virus replication
Millimeter wave imaging method and system to detect concealed objects
Online data conversion technique using a sliding window
Water bottle warning triangle
  Randomly Featured Patents
Handleset escutcheon
Superconductive element containing Nb.sub.3Sn
Communication apparatus and helmet
Vapor compression systems, expansion devices, flow-regulating members, and vehicles, and methods for using vapor compression systems
Enhanced scattering in voltage sensitive encapsulated liquid crystal
Variable speed hydraulic pump system for liquid trailer
Red-shifted tris-aryl-s-triazines
Modified polymer and composition containing the same
Fuel cell power plant and control method thereof
Rose plant named `Lavjune`