Resources Contact Us Home
Semiconductor circuit device adaptable to plurality of types of packages

Image Number 16 for United States Patent #6873563.

Data pad regions are arranged in four divided regions of a semiconductor memory chip of a rectangular shape, respectively, and data pads are selectively utilized in each of the four divided regions in accordance with a word structure. Thus, it is possible to implement a semiconductor memory chip capable of being assembled in both a single chip package and a multi chip package.

  Recently Added Patents
Generating a representation of an object of interest
Support for a portable electronic device
Method for preparing a .beta.-SiAlON phosphor
Facial recognition using a sphericity metric
Clusterin antisense therapy for treatment of cancer
Decentralized processing network
  Randomly Featured Patents
Transfer circuit for signal lines
Method of lasting an article of footwear and footwear made thereby
Method and apparatus for skinning frozen fish
Memory address generator
Method and apparatus for transparent intermediate system based filtering on a LAN multicast packets
Electrical heating systems
Anti-skid mat for accessories in an automobile
Multiple sleeve valve assembly
Steam turbine blade, and steam turbine and steam turbine power plant using the same
Data-flow multiprocessor architecture with three dimensional multistage interconnection network for efficient signal and data processing