Resources Contact Us Home
Semiconductor circuit device adaptable to plurality of types of packages

Image Number 16 for United States Patent #6873563.

Data pad regions are arranged in four divided regions of a semiconductor memory chip of a rectangular shape, respectively, and data pads are selectively utilized in each of the four divided regions in accordance with a word structure. Thus, it is possible to implement a semiconductor memory chip capable of being assembled in both a single chip package and a multi chip package.

  Recently Added Patents
Supply voltage generating circuit and semiconductor device having the same
Method and system for automatically hiding irrelevant parts of hierarchical structures in computer user interfaces
Provision of downlink packet access services to user equipment in spread spectrum communication network
Electronic device
Curved structural part made of composite material and a process for manufacturing such a part
Monitoring and correcting upstream packet loss
Electrical connector
  Randomly Featured Patents
Method for the field-oriented control of an induction motor
Digital yacht racing timing system
Warming cap for a shoe or boot
Antibiotic-sensitive lactic acid bacteria strains
Rotatable exercise device
Method for fabricating semiconductor component with chip on board leadframe
Method of control for a refrigerated merchandiser
Polarization stabilization
Alphanumeric font
Process for the purification of insulins by chromatography