Resources Contact Us Home
Chemical mechanical polishing of a metal layer with polishing rate monitoring

Image Number 5 for United States Patent #6869332.

A method of chemical mechanical polishing a metal layer on a substrate in which the substrate is polished at a first polishing rate. Polishing is monitored with an eddy current monitoring system, and the polishing rate is reduced to a second polishing rate when the eddy current monitoring system indicates that a predetermined thickness of the metal layer remains on the substrate. Then polishing is monitored with an optical monitoring system, and polishing is halted when the optical monitoring system indicates that an underlying layer is at least partially exposed.

  Recently Added Patents
DFPase enzymes from Aplysia californica
Methods and systems to reduce a number of simulations in a timing analysis
Method and apparatus for detecting and tracking vehicles
Thin film transistor and flat panel display device including the same
Bluetooth headset
Liquid crystal display apparatus
Probe for ultrasound diagnostic apparatus
  Randomly Featured Patents
Minimizing emission of hexavalent chromium from combustion sources
Diffractive optical element and also optical arrangement comprising a diffractive optical element
Operational amplifier with rail-to-rail common-mode input and output range
Article and method for the oral dosing of fluidic material to patients
Concealed electrical conductor detecting system
Method and apparatus for recording a three-dimensional image of a body part
Method of forming a MOS device with an additional layer
Balanced filter circuit having a single amplifier
Method for storing metadata in a physical sector
Methods for manufacturing frets for stringed instruments