Resources Contact Us Home
Chemical mechanical polishing of a metal layer with polishing rate monitoring

Image Number 11 for United States Patent #6869332.

A method of chemical mechanical polishing a metal layer on a substrate in which the substrate is polished at a first polishing rate. Polishing is monitored with an eddy current monitoring system, and the polishing rate is reduced to a second polishing rate when the eddy current monitoring system indicates that a predetermined thickness of the metal layer remains on the substrate. Then polishing is monitored with an optical monitoring system, and polishing is halted when the optical monitoring system indicates that an underlying layer is at least partially exposed.

  Recently Added Patents
Lubricating oil with enhanced protection against wear and corrosion
Fishing apparatus
Controller with screen
Jet pump and reactor
Container pack
Package for a medicinal product
Systems and methods for generating a hybrid text string from two or more text strings generated by multiple automated speech recognition systems
  Randomly Featured Patents
Animal feed and process
Air dryer system and method employing a jet engine
Method and apparatus for processing failures during semiconductor device testing
System for deploying spatial appendices and spatial appendix comprising such a system
Digital media content distribution
Pulse width position modulator and clock skew synchronizer
Continuously variable traction transmission and control system
Multiple zone limiting orifice drying of cellulosic fibrous structures, apparatus therefor, and cellulosic fibrous structures produced thereby
Ligands for phosphatase binding assay
Toolless splice sealant device