Resources Contact Us Home
System and method for current-enhanced stress-migration testing of interconnect

Image Number 11 for United States Patent #6867056.

For testing for stress-migration failure of interconnect, an interconnect test structure is formed with a first feeder line coupled to a test line by a first no-flux structure, and with a second feeder line coupled to the test line by a second no-flux structure. A respective width of ea ch of the first and second feeder lines is greater than a width of the test line. A resistance meter and a timer measure a stress-migration life-time of the interconnect test structure with a current being continuously conducted through the interconnect test structure that is continuously heated to a predetermined temperature.

  Recently Added Patents
Lithographic apparatus and device manufacturing method
Multilayered ceramic electronic component and fabrication method thereof
Remotely provisioned wireless proxy
Liquid crystal display device with a control mechanism for eliminating images
Power supply system for motor vehicle
Package for a medicinal product
Electrifying roller
  Randomly Featured Patents
Blower and air conditioner outdoor unit with the blower
Microorganism, lactamase enzyme obtained therefrom, and their use
Device and method for detecting the presence of an object
Silver-silver chloride electrode
Overload protection mechanism and shaft coupling device using the same
Computer-based interlocking system
Multiple-instance-learning-based video classification
Monitor display
Single-pass roof bolt and apparatus and method for installation
Method of producing food patties using multiple row molding apparatus