Resources Contact Us Home
Semiconductor device with fuses

Image Number 5 for United States Patent #6858914.

A semiconductor device has: a semiconductor substrate having a principal surface; a fuse circuit formed above the principal surface, the fuse circuit having fuse elements each having a predetermined breaking point; a first trench isolation region formed in a surface layer of the semiconductor substrate under the fuse circuit; and a plurality of active region dummies formed through the first trench isolation region in an area excepting a predetermined area around the predetermined breaking point. Although a dummy structure is formed also in a fuse circuit, a breaking margin is prevented from being lowered and a substrate damage is avoided, while surface flatness and line width controllability are ensured.

  Recently Added Patents
Disk drive to enable defect margining
Sensor interface engineering
Thwarting keyloggers using proxies
Systems and methods for synchronizing and controlling multiple image sensors
Leadless integrated circuit packaging system and method of manufacture thereof
Polyfunctional sulfur-containing epoxies and compositions thereof
Systems and related methods of user-guided searching
  Randomly Featured Patents
TFT and reliability evaluation method thereof
Cyanide-free lytic reagent composition and method for hemoglobin and cell analysis
Mobile communication apparatus having multi-codes allocating function
Service time analysis methods for the WSM QOS monitor
Control device with terminal 15--holding circuit
Grate with replaceable wear elements
Apparatus and method for biogas purification
Facsimile communicating aid
Device for providing power to portable electronic devices
Simultaneous transmissions during a transmission opportunity