Resources Contact Us Home
Semiconductor device with fuses

Image Number 2 for United States Patent #6858914.

A semiconductor device has: a semiconductor substrate having a principal surface; a fuse circuit formed above the principal surface, the fuse circuit having fuse elements each having a predetermined breaking point; a first trench isolation region formed in a surface layer of the semiconductor substrate under the fuse circuit; and a plurality of active region dummies formed through the first trench isolation region in an area excepting a predetermined area around the predetermined breaking point. Although a dummy structure is formed also in a fuse circuit, a breaking margin is prevented from being lowered and a substrate damage is avoided, while surface flatness and line width controllability are ensured.

  Recently Added Patents
Methods of fabricating semiconductor device
Semiconductor device and fabrication method
Method for switching channels in a wireless communication network
Electronic component mounting machine and operating instruction method for the same
Question and answer system wherein experts are associated with models and have response rates that are associated with time intervals
Audio and music data transmission medium and transmission protocol
Power supply apparatus for light emitting diode
  Randomly Featured Patents
Fibrous anisotropic permanent magnet and production process thereof
Weight determining system
Tissue compensation method and apparatus
Process for producing filled polytetrafluoroethylene resin composite materials and products
Combined ceiling fan housing and light kit
Synchronization apparatus for speed-changing gearing or transmissions, especially for vehicles
Integrally molded sweeping implement
Tissue or towel dispenser
Corneal intra-stromel prostheses