Image Number 6 for United States Patent #6727195.
A method and system for providing a semiconductor device is disclosed. The method and system include providing a semiconductor substrate and providing a plurality of lines separated by a plurality of spaces. Each of the plurality of spaces preferably has a first width that is less than a minimum feature size. In one aspect, the method and system include providing a reverse mask having a plurality of apertures on an insulating layer. In this aspect, the method and system also include trimming the reverse mask to increase a size of each of the plurality of apertures, removing a portion of the insulating layer exposed by the plurality of trimmed apertures to provide a plurality of trenches and providing a plurality of lines in the plurality of trenches. In a second aspect, the method and system include providing a reverse mask on the insulating layer and removing a first portion of the insulating layer exposed by the plurality of apertures to provide a plurality of trenches. The reverse mask includes a plurality of apertures having a first width. Each of the plurality of trenches has a width. In this aspect, the method and system also include trimming a second portion of the insulating layers to increase the width of each of the plurality of trenches and providing a plurality of lines in the plurality of trenches.
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