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Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus

Image Number 3 for United States Patent #6716087.

A dresser is used which makes it possible to simultaneously dress and condition the surface of a polishing pad deteriorated by polishing a semiconductor wafer in the CMP process. The dresser is a dresser comprised of a ceramic such as dressing SiC, SiN, alumina or silica. Use of this dresser enables to shorten the time of dressing/conditioning the deteriorated polishing pad.

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