Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Barrier layer associated with a conductor layer in damascene structures










Image Number 6 for United States Patent #6713875.

The present invention is directed to a simplified, CVD-less method of forming a barrier layer for a metal layer which prevents metal contamination in an integrated circuit. The invention utilizes a sacrificial multilayer dielectric structure and selective etching to form the top barrier layer. An opening is etched in the structure and a plating layer is deposited in the opening. A first unneeded portion of the structure along with an unneeded portion of the plating layer is removed utilizing an etchant that is selective for the first unneeded structural portion. A Cu layer is deposited and implanted with barrier material to form the top barrier layer. A second unneeded portion of the structure along with an unneeded portion of the top barrier layer is removed utilizing an etchant that is selective for the second unneeded structural portion. The resulting structure is a metal interconnect structure having an overlying top barrier layer which is produced without using CVD techniques.








 
 
  Recently Added Patents
Maize variety X00C175
Method and system for shared high speed cache in SAS switches
Administrable compositions
Desk
Extensible framework for client-based active network measurement
Electronic dispersion compensation within optical communications using reconstruction
Vehicle running control system
  Randomly Featured Patents
Gas-solids separator
Supporting hybrid automatic retransmission request in orthogonal frequency division multiplexing access radio access system
Handlebar stem structure
Internal orbital engine
Nonvolatile semiconductor memory device including access code circuitry
Automated selection of a protocol by a communicating entity to match the protocol of a communications network
Weapons firing safeties and methods of operating the same
Turbine rotor and turbine blade
Apparatus for taking up a bundle of filaments
Magnetically actuated linear valve operator and method