Resources Contact Us Home
Two stage cooling system employing thermoelectric modules

Image Number 4 for United States Patent #6705089.

A cooling system is provided for cooling a heat generating component of an electronic device. The cooling system includes at least two cooling subsystems for a staged reduction of the temperature of a cooling fluid exposed to heat generated by the heat generated component. A first stage cooling subsystem reduces the temperature of the cooling fluid to ambient temperature or above, while a second stage cooling subsystem reduces the temperature of the cooling fluid exiting the first stage cooling subsystem to below ambient temperature. The first stage cooling subsystem is passive while the second stage cooling subsystem is active and can include one or more thermoelectric modules.

  Recently Added Patents
Heat shield and laminated glass
Method to alter silicide properties using GCIB treatment
Off-line converter with digital control
Method and system for leveraging the power of one's social-network in an online marketplace
Method and system for simulating wireless networks
Fibrous laminate interface for security coatings
Local call local switching at handover
  Randomly Featured Patents
Method using device for easy pick up of small objects
Wafer fabrication of die-bottom contacts for electronic devices
Musical mobile
Analog/digital signal processor and analog/digital signal processing method
Ball-point pen
Plastics bag
Systems and methods for detecting an image of an object by use of X-ray beams generated by multiple small area sources and by use of facing sides of adjacent monochromator crystals
Coil component
Optical memory
Carrier structure embedded with semiconductor chip