Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Use of scatterometry/reflectometry to measure thin film delamination during CMP










Image Number 6 for United States Patent #6702648.

One aspect of the present invention relates to a system and method for examining a wafer for delamination in real time while polishing the wafer. The system comprises a polishing system programmed to planarize one or more film layers formed on at least a portion of a semiconductor wafer surface; a real-time metrology system coupled to the polishing system such that the metrology system examines the layers as they are planarized; and one or more delamination sensors, wherein at least a portion of each sensor is integrated into the polishing system in order to provide data to the metrology system and wherein the sensor comprises at least one optical element to detect delamination during polishing. The method involves polishing at least a portion of an uppermost film layer and examining at least a portion of a layer underlying the uppermost film layer for delamination as the uppermost layer is being polished.








 
 
  Recently Added Patents
System and method for reducing antivirus false positives
Toy
Image generation based on a plurality of overlapped swathes
Circuit board having semiconductor chip embedded therein
System and method for netbackup data decryption in a high latency low bandwidth environment
Watch dial
System and method for detecting an earth ground fault of an external power supply connected to a vehicle
  Randomly Featured Patents
Multi-coil actuator with end cap flux carrier
Voltage detector using electro-optic material having anti-reflective coatings
Contact assembly for an electrical connector
Contact lens treatment apparatus
Method and apparatus for manufacturing load bearing fabric support structures
Cutterbar for a crop harvesting machine
Toy vehicle
Change gear apparatus and method
Caching in multicore and multiprocessor architectures
Electrical connector