Resources Contact Us Home
Use of scatterometry/reflectometry to measure thin film delamination during CMP

Image Number 6 for United States Patent #6702648.

One aspect of the present invention relates to a system and method for examining a wafer for delamination in real time while polishing the wafer. The system comprises a polishing system programmed to planarize one or more film layers formed on at least a portion of a semiconductor wafer surface; a real-time metrology system coupled to the polishing system such that the metrology system examines the layers as they are planarized; and one or more delamination sensors, wherein at least a portion of each sensor is integrated into the polishing system in order to provide data to the metrology system and wherein the sensor comprises at least one optical element to detect delamination during polishing. The method involves polishing at least a portion of an uppermost film layer and examining at least a portion of a layer underlying the uppermost film layer for delamination as the uppermost layer is being polished.

  Recently Added Patents
Apparatus for performing timer management regarding a system timer scheduler service, and associated method
Medical capsule housing formed by thermal welding
System and method for logical separation of a server by using client virtualization
Extract of Vanilla planifolia
Pyrrolidine derivatives, pharmaceutical compositions containing the same, and methods of using the same
Module-code verification layer to automatically validate user input
Hypallergenic mosaic antigens and methods of making same
  Randomly Featured Patents
Sanitary napkin
Method and apparatus for adaptive power adjustment based on reduction of cross-talk between DSLs
Process for producing silicon carbide
Mower conditioner swathboard support with down stop
Portable telephone mounting base
Container data center
Side view mirror
Method for making a pre-testable semiconductor die package
Optical information recording medium and method of manufacturing optical information recording medium
Method for extracting nylon from waste materials