Resources Contact Us Home
Multilayer circuit board and method of manufacturing the same

Image Number 9 for United States Patent #6701613.

In a method of manufacturing a multilayer circuit board, cable patterns in a plurality of cable layers can be precisely formed, and the cable layer are formed with higher density, with higher reliability. The multilayer circuit board comprises: a plurality of cable layers, each of which includes electric conductive sections; a plurality of first insulating layers, each of which encloses the electric conductive sections in each cable layer and fills spaces between the electric conductive sections; and post vias electrically connecting the electric conductive sections in one cable layer to those in another cable layer. Height of the electric conductive sections in each cable layer are equal to that of the first insulating layer enclosing those electric conductive sections.

  Recently Added Patents
Method and apparatus for user selection of advertising combinations
Luminescent nanosheets, and fluorescent illuminators, solar cells and color displays utilizing the same as well as nanosheet paints
Contactless electrical connector for an induction sensor, and sensor including such a connector
Liquid low temperature injection molding process
Particle-loaded membrane for solid-phase-extraction and method for performing SALDI-MS analysis of an analyte
Programming of DIMM termination resistance values
Dental plier
  Randomly Featured Patents
Computer keyboard assembly having separable top and bottom modules
Method for bridging and routing data frames via a network switch comprising a special guided tree handler processor
Wave timepiece
Method for measurement of OSF density
Grease collection system for range
Method and apparatus for inferring topology of a network
Electromagnetic relay
Pattern selection system for a sewing machine
Wireless quadrature modulator transmitter using E/O and O/E connectives
Apparatus for coating lenses