Resources Contact Us Home
Multilayer circuit board and method of manufacturing the same

Image Number 9 for United States Patent #6701613.

In a method of manufacturing a multilayer circuit board, cable patterns in a plurality of cable layers can be precisely formed, and the cable layer are formed with higher density, with higher reliability. The multilayer circuit board comprises: a plurality of cable layers, each of which includes electric conductive sections; a plurality of first insulating layers, each of which encloses the electric conductive sections in each cable layer and fills spaces between the electric conductive sections; and post vias electrically connecting the electric conductive sections in one cable layer to those in another cable layer. Height of the electric conductive sections in each cable layer are equal to that of the first insulating layer enclosing those electric conductive sections.

  Recently Added Patents
Gaming device providing an award based on a count of outcomes which meets a condition
Liquid crystal display device
Cap block for capping walls
Sink accessory
Peperidine-flavan alkaloid compounds derived from African herb tea kinkeliba as anti-diabetic agents
System for electronically recording and sharing medical information
  Randomly Featured Patents
Multi-lobed buoyant launch capsule
Spectra generator for test and calibration
Array substrate having connection wirings
Off-line broadband network interface
Human phospholipase A2 and related nucleic acid compounds
Single chip microprocessor with on-chip modifiable memory
Scroll compressor
Monotonic pulse detector
Joint IC card and wireless transceiver module for mobile communication equipment
Cabinet hinge