Resources Contact Us Home
Multilayer circuit board and method of manufacturing the same

Image Number 9 for United States Patent #6701613.

In a method of manufacturing a multilayer circuit board, cable patterns in a plurality of cable layers can be precisely formed, and the cable layer are formed with higher density, with higher reliability. The multilayer circuit board comprises: a plurality of cable layers, each of which includes electric conductive sections; a plurality of first insulating layers, each of which encloses the electric conductive sections in each cable layer and fills spaces between the electric conductive sections; and post vias electrically connecting the electric conductive sections in one cable layer to those in another cable layer. Height of the electric conductive sections in each cable layer are equal to that of the first insulating layer enclosing those electric conductive sections.

  Recently Added Patents
Modular utility rack
Binder for secondary battery providing excellent adhesion strength and cycle property
Computer server capable of supporting CPU virtualization
Image sensor with improved color crosstalk
Spray drying vancomycin
  Randomly Featured Patents
Vehicle airbelt apparatus
Method and system for providing distributed web server authentication
Operational track-and-hold amplifier
Computer systems and methods for the query and visualization of multidimensional databases
Silyl ester copolymer compositions
Grease containment system
Optoelectronic component and optoelectronic arrangement with an optoelectronic component
Horizontal shelf unit for handling papers
Scheme for encoding a magnetic tape cassette
Ozone generating apparatus