Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Multilayer circuit board and method of manufacturing the same










Image Number 9 for United States Patent #6701613.

In a method of manufacturing a multilayer circuit board, cable patterns in a plurality of cable layers can be precisely formed, and the cable layer are formed with higher density, with higher reliability. The multilayer circuit board comprises: a plurality of cable layers, each of which includes electric conductive sections; a plurality of first insulating layers, each of which encloses the electric conductive sections in each cable layer and fills spaces between the electric conductive sections; and post vias electrically connecting the electric conductive sections in one cable layer to those in another cable layer. Height of the electric conductive sections in each cable layer are equal to that of the first insulating layer enclosing those electric conductive sections.








 
 
  Recently Added Patents
Solid-state imaging apparatus
Fuel cell with air channel actuator
Lacrosse head
Level shifter and method of using the same
Measurement system service for a vehicle instrument panel
Basket for a dishwasher
Front face of a vehicle wheel
  Randomly Featured Patents
Synthetic resin paper
Thermoplastic bag having reinforced handles and method of manufacture
Passive water management techniques in direct methanol fuel cells
Motif of the beclin protein which interacts with anti-apoptotic members of the Bcl-2 protein family, and uses
Clasp
Layered transformer coil having conductors projecting into through holes
Ink jet head utilizing electroviscous fluid for control of ink discharge
Unloading valve for hopper car
Front to back resistive random access memory cells
Method of making a ceramic article