Resources Contact Us Home
Multilayer circuit board and method of manufacturing the same

Image Number 9 for United States Patent #6701613.

In a method of manufacturing a multilayer circuit board, cable patterns in a plurality of cable layers can be precisely formed, and the cable layer are formed with higher density, with higher reliability. The multilayer circuit board comprises: a plurality of cable layers, each of which includes electric conductive sections; a plurality of first insulating layers, each of which encloses the electric conductive sections in each cable layer and fills spaces between the electric conductive sections; and post vias electrically connecting the electric conductive sections in one cable layer to those in another cable layer. Height of the electric conductive sections in each cable layer are equal to that of the first insulating layer enclosing those electric conductive sections.

  Recently Added Patents
Apparatus and method for layered decoding in a communication system using low-density parity-check codes
Automated tuning in a virtual machine computing environment
Tab visibility
Verbena plant named `Duempsopicha`
Identification of protected content in e-mail messages
Mobile computing terminal
Tint block image generation program and tint block image generation device
  Randomly Featured Patents
Suspension device for charging and storing batteries
Gate valve for plus-atmospheric pressure semiconductor process vessels
Directional antenna arrangement method for simulcast broadcasting
Modular incubator control system with self-test capability
Systems to cool multiple electrical components
Satellite telecommunication system
Pump diode driver circuit
Method and apparatus for production of foamed thermoplastic material
Self correcting nozzle useful with current to pressure transducer
Interrupt and control packets for a microcomputer