Resources Contact Us Home
Multilayer circuit board and method of manufacturing the same

Image Number 9 for United States Patent #6701613.

In a method of manufacturing a multilayer circuit board, cable patterns in a plurality of cable layers can be precisely formed, and the cable layer are formed with higher density, with higher reliability. The multilayer circuit board comprises: a plurality of cable layers, each of which includes electric conductive sections; a plurality of first insulating layers, each of which encloses the electric conductive sections in each cable layer and fills spaces between the electric conductive sections; and post vias electrically connecting the electric conductive sections in one cable layer to those in another cable layer. Height of the electric conductive sections in each cable layer are equal to that of the first insulating layer enclosing those electric conductive sections.

  Recently Added Patents
Methods for non-linear image blending, adjustment and display
Method and apparatus for distributing promotional materials
Restarting event and alert analysis after a shutdown in a distributed processing system
MiR 204, miR 211, their anti-miRs, and therapeutic uses of same
Method and apparatus for wireless communication in a mesh network with central control of communication relationships
Gyroscope utilizing torsional springs and optical sensing
Potentiometric-sensor chip, potentiometric assay, and assay kit
  Randomly Featured Patents
Neural network system for classifying fingerprints
Organic electrolytic cell
Primary piston correction during transfer
Contrast enhancement of an image using luminance and RGB statistical metrics
System for monitoring and reporting medical measurements
Light emitting diode module
Protective sleeve for garment apparel
Glide head for detecting defects on a disk surface
Access tower
Hot air welder for welding roofing material