Resources Contact Us Home
Multilayer circuit board and method of manufacturing the same

Image Number 9 for United States Patent #6701613.

In a method of manufacturing a multilayer circuit board, cable patterns in a plurality of cable layers can be precisely formed, and the cable layer are formed with higher density, with higher reliability. The multilayer circuit board comprises: a plurality of cable layers, each of which includes electric conductive sections; a plurality of first insulating layers, each of which encloses the electric conductive sections in each cable layer and fills spaces between the electric conductive sections; and post vias electrically connecting the electric conductive sections in one cable layer to those in another cable layer. Height of the electric conductive sections in each cable layer are equal to that of the first insulating layer enclosing those electric conductive sections.

  Recently Added Patents
Display screen with graphical user interface
Clock distribution circuit
Mounting structure, electro-optical apparatus, and touch panel
Electrical stimulation lead, system, and method
Storage basket with lid
Solid-state imaging apparatus, method of manufacturing solid-state imaging apparatus, and electronic apparatus
  Randomly Featured Patents
Silicon-containing alcohols and polymers having silicon-containing tertiary ester groups made therefrom
Ink display for multi-stroke hand entered characters
Screen fabrication
Antiviral and comma antibacterial pharmaceutical compositions of cantharidic anhydride and method of preparation thereof
Landscaping brick
Process for supplying heat to an object and container for keeping dishes hot and reheating dishes
Spinal tissue distraction devices
Method of making a flexible solid electrolyte for use in solid state cells
System and method for gradually bringing rolled in data online with incremental deferred integrity processing
Systems for electrically connecting circuit board based electronic devices