Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Multilayer circuit board and method of manufacturing the same










Image Number 9 for United States Patent #6701613.

In a method of manufacturing a multilayer circuit board, cable patterns in a plurality of cable layers can be precisely formed, and the cable layer are formed with higher density, with higher reliability. The multilayer circuit board comprises: a plurality of cable layers, each of which includes electric conductive sections; a plurality of first insulating layers, each of which encloses the electric conductive sections in each cable layer and fills spaces between the electric conductive sections; and post vias electrically connecting the electric conductive sections in one cable layer to those in another cable layer. Height of the electric conductive sections in each cable layer are equal to that of the first insulating layer enclosing those electric conductive sections.








 
 
  Recently Added Patents
Superagonistic anti-CD28 antibodies
Efficient paging in a wireless communication system
Device for determining the absolute angular position of the steering wheel of an electric power-assisted steering column of a motor vehicle using weighted dynamic parameters of the vehicle
Tractor
Projection screen and projection system having the same
Superconducting magnetizer
Transferases and oxidoreductases, nucleic acids encoding them and methods for making and using them
  Randomly Featured Patents
Associating a biometric reference template with an identification tag
High pressure multi-stage centrifugal blower
Magnetic resonance apparatus having a bulged interior bore filled with a mass augmentation
Massively parallel array processing system
Filament support for tubular lamp
Method of reestablishing communication by a mobile node upon recovery from an abrupt shut down
Effecting financial transactions
Socket organizer
Speculative packet selection for transmission of isochronous data
Discharge lamp lighting device