Resources Contact Us Home
Multilayer circuit board and method of manufacturing the same

Image Number 9 for United States Patent #6701613.

In a method of manufacturing a multilayer circuit board, cable patterns in a plurality of cable layers can be precisely formed, and the cable layer are formed with higher density, with higher reliability. The multilayer circuit board comprises: a plurality of cable layers, each of which includes electric conductive sections; a plurality of first insulating layers, each of which encloses the electric conductive sections in each cable layer and fills spaces between the electric conductive sections; and post vias electrically connecting the electric conductive sections in one cable layer to those in another cable layer. Height of the electric conductive sections in each cable layer are equal to that of the first insulating layer enclosing those electric conductive sections.

  Recently Added Patents
Piperazinyl methyl phenyl cyclohexane compound
System and method for operating an electric power converter
Reserving a time block in a calendar application to account for a travel time between geographic locations of appointments
Bluetooth headset
Electrode and method for manufacturing the same
Process cartridge and electrophotographic image forming apparatus
Apparatus and method for image reconstruction and CT system
  Randomly Featured Patents
Battlefield magazine with external reinforcing frame
Undergarment with absorbing pads that can be worn over a brassiere
Photoconductive CdS powder material for electrophotography
Screen for a liquid crystal projector
Magnetic head device having magnetic head and base plate interconnected by folding flexible wiring board
Remote control of VCR with electronic mail
Microsample handling apparatus
Refrigerant condenser
System and method for producing cured composites