Resources Contact Us Home
Electronic component having a semiconductor chip

Image Number 7 for United States Patent #6653732.

An electronic component includes a semiconductor chip and/or a test structure. The semiconductor chip includes a multi-layer coating having at least one interconnect layer, at least one insulation layer, and at least one planarization layer. A method of producing the component is also disclosed. Embedded adhesion regions are provided in the planarization layer, whereby the adhesion regions provide adhesion surfaces to the adjacent insulation layers.

  Recently Added Patents
Wireless communication system, wireless communication device, wireless communication method, and program
Sporting goal practice screen
Device to control force required to depress accelerator pedal
Apparatus and methods for providing efficient space-time structures for preambles, pilots and data for multi-input, multi-output communications systems
Modular storage system
Quantitative sleep analysis system and method
Method for eliciting an immune response to human telomerase reverse transcriptase
  Randomly Featured Patents
Tuning circuit having a resonance circuit and a negative resistance circuit
Multithread embedded processor with input/output capability
Energy director for ultrasonic weld joint
Digital cryptographic system having synchronous and asynchronous capabilities
Electronic speech control apparatus and methods
Solar panel with polymeric cover
Method and device for decoding low-density parity check code and optical information reproducing apparatus using the same
Asynchronous full adder, asynchronous microprocessor and electronic apparatus
Disk-mounting structure for optical encoder
Display tree with bubble trunk