Resources Contact Us Home
Electronic component having a semiconductor chip

Image Number 7 for United States Patent #6653732.

An electronic component includes a semiconductor chip and/or a test structure. The semiconductor chip includes a multi-layer coating having at least one interconnect layer, at least one insulation layer, and at least one planarization layer. A method of producing the component is also disclosed. Embedded adhesion regions are provided in the planarization layer, whereby the adhesion regions provide adhesion surfaces to the adjacent insulation layers.

  Recently Added Patents
Compound semiconductor epitaxial structure and method for fabricating the same
Health monitoring of applications in a guest partition
Apparatus and method for controlling a tunable matching network in a wireless network
Generating network topology parameters and monitoring a communications network domain
Rate controlled first in first out (FIFO) queues for clock domain crossing
Portable electric circular saw
Horizontal card holder
  Randomly Featured Patents
Apparatus for an inclinable support of a speaker
Wireless communication system, wireless base station, user equipment, and multi service management equipment
Acceleration sensor apparatus and method for making same
Optomagnetic recording/reproducing apparatus
Non-aqueous electrolyte secondary battery
Image sensor with protective package structure for sensing area
Survival information ski pole
Sugar-bowl with two teaspoon-holders
Method for preparing dispersions containing antibiotic power
Connection system for fast power supplies