Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Power semiconductor device having layered structure of power semiconductor elements and terminal members










Image Number 11 for United States Patent #6642576.

An IGBT (121) and a diode (131) are joined onto an element arrangement portion (111a) of a first terminal member (111) and an element arrangement portion (112a) of a second terminal member (112) is joined onto the IGBT (121) and the diode (131). Further, an IGBT (122) and a diode (132) are joined onto the element arrangement portion (112a) of the second terminal member (112) and an element arrangement portion (113a) of a third terminal member (113) is joined onto the IGBT (122) and the diode (132). A transfer mold package (141) is so formed as to house the elements (121, 122, 131, 132). External connection portions (111b, 112b, 113b) of the terminal members (111, 112, 113) are drawn out of the package (141). The element arrangement portion(s) (111a, 113a) of the first and/or third terminal member (111, 113) are/is exposed out of the package (141).








 
 
  Recently Added Patents
Digital image processing device and processing method thereof
Sink
Maize hybrid X95C382
Removable storage device and method for identifying drive letter of the removable storage device
Superconducting magnetizer
Data center with free-space optical communications
System, method and program recording medium for supply capacity estimation
  Randomly Featured Patents
Free flowing particles of elastomeric material and method
Towed watercraft
Memory architecture and method of manufacture and operation thereof
Connecting device with cable
Selective NPY (Y5) antagonists (triazines)
Edge density detection
Integrated circuit system employing dipole multiple exposure
Method for correction of relative object-detector motion between successive views
Internal voltage generator
Tenter unit