Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Power semiconductor device having layered structure of power semiconductor elements and terminal members










Image Number 11 for United States Patent #6642576.

An IGBT (121) and a diode (131) are joined onto an element arrangement portion (111a) of a first terminal member (111) and an element arrangement portion (112a) of a second terminal member (112) is joined onto the IGBT (121) and the diode (131). Further, an IGBT (122) and a diode (132) are joined onto the element arrangement portion (112a) of the second terminal member (112) and an element arrangement portion (113a) of a third terminal member (113) is joined onto the IGBT (122) and the diode (132). A transfer mold package (141) is so formed as to house the elements (121, 122, 131, 132). External connection portions (111b, 112b, 113b) of the terminal members (111, 112, 113) are drawn out of the package (141). The element arrangement portion(s) (111a, 113a) of the first and/or third terminal member (111, 113) are/is exposed out of the package (141).








 
 
  Recently Added Patents
Apparatus and method for evaluating an activity distribution, and irradiation system
Ranging method and apparatus in passive optical network
Eyeglasses
Seat post having a non-uniform cross-section
Mono-body defibrillation probe
Method of modified facies proportions upon history matching of a geological model
Laser receiver for detecting a relative position
  Randomly Featured Patents
Medical sensor with amplitude independent output
Trailer
Self-storing outrigger float assembly
Wireless timing and power control
Shelf structure for a display rack
Urea-surfactant clathrates and their use in bioremediation of hydrocarbon contaminated soils and water
Cut-resistant articles of aramid microfilaments
Wet hygienic towel dispenser
Copper-base alloy cleaning solution
Example-based image analysis and synthesis using pixelwise correspondence