Resources Contact Us Home
Hermetic encapsulation package and method of fabrication thereof

Image Number 7 for United States Patent #6611098.

A hermetic encapsulation package and a method of fabricating such package, wherein at least one organic electroluminescent (EL) element is formed on a support substrate. A sealing cap for accommodating the organic EL element is bonded to the support substrate with an ultraviolet curing resin to form a sealed space defined by the sealing cap and the support substrate. At least part of the sealing cap is formed of an elastic material of a Young's modulus of 70 GPa or less. The elastic portion of the sealing cap is reversibly deflected to provide a decrease or increase in the volume of the sealed space to reduce pressure changes inside the sealed space caused by changes in temperature, thereby alleviating problems of thermal shock.

  Recently Added Patents
Actuator, actuator structure and method of manufacturing actuator
Catalysts for polyurethane coating compounds
Beverage container lid
Aggregating completion messages in a sideband interface
Wearable display device
System and method for providing definitions
Rotating device
  Randomly Featured Patents
Methods for coating lenses
High-resolution single photon planar and spect imaging of brain and neck employing a system of two co-registered opposed gamma imaging heads
Methods and systems for computing gear modifications
Oral pharmaceutical dosage form
Methods for fabricating integrated circuits with controlled P-channel threshold voltage
Fluorescent polycarbonate articles
Ski pole trail map holder
Track lighting system with dependent lamp cord
Wound capacitor comprising an excess-pressure safety device
Method of controlling an electric motor, a system for controlling an electric motor and an electric motor