Resources Contact Us Home
Hermetic encapsulation package and method of fabrication thereof

Image Number 7 for United States Patent #6611098.

A hermetic encapsulation package and a method of fabricating such package, wherein at least one organic electroluminescent (EL) element is formed on a support substrate. A sealing cap for accommodating the organic EL element is bonded to the support substrate with an ultraviolet curing resin to form a sealed space defined by the sealing cap and the support substrate. At least part of the sealing cap is formed of an elastic material of a Young's modulus of 70 GPa or less. The elastic portion of the sealing cap is reversibly deflected to provide a decrease or increase in the volume of the sealed space to reduce pressure changes inside the sealed space caused by changes in temperature, thereby alleviating problems of thermal shock.

  Recently Added Patents
Partial recall of deduplicated files
Manufacturing method of apparatus for generating electrical energy
User and device localization using probabilistic device log trilateration
Therapeutic agent or preventive agent for urine collection disorder
Hinge assemblies
Piston for positioning a food pot decoration in a mold and associated device
Non-etched flat polarization-selective diffractive optical elements
  Randomly Featured Patents
Sleeve detent latch means for well apparatus
Zoom lens of a camera
Guide sleeve for offset vertebrae
Method and apparatus for developing shafts using small diameter shafts
Styling comb
Lead frame and semiconductor device made using the lead frame
Portable female catheter
Method and apparatus for creating and editing node-link diagrams in pen computing systems
Customizable nest for positioning a device under test
Printhead structure and method of fabrication