Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Hermetic encapsulation package and method of fabrication thereof










Image Number 7 for United States Patent #6611098.

A hermetic encapsulation package and a method of fabricating such package, wherein at least one organic electroluminescent (EL) element is formed on a support substrate. A sealing cap for accommodating the organic EL element is bonded to the support substrate with an ultraviolet curing resin to form a sealed space defined by the sealing cap and the support substrate. At least part of the sealing cap is formed of an elastic material of a Young's modulus of 70 GPa or less. The elastic portion of the sealing cap is reversibly deflected to provide a decrease or increase in the volume of the sealed space to reduce pressure changes inside the sealed space caused by changes in temperature, thereby alleviating problems of thermal shock.








 
 
  Recently Added Patents
Removable storage device and method for identifying drive letter of the removable storage device
Document layout method
Haworthia plant named `AMSTERDAM`
System and method for multi-tiered meta-data caching and distribution in a clustered computer environment
Digital broadcasting system and method of processing data
Oxidative coupling of hydrocarbons as heat source
Bottle
  Randomly Featured Patents
Contact plug and interconnect employing a barrier lining and a backfilled conductor material
Synthesis of diorgano tellurides
Steering wheel
Brazing method by continuous furnace
Face shock absorber for extracting core-collecting pipes
Filter medium for selectively removing leucocytes
Device for utilizing the kinetic energy of flowing water
High density MOS memory array
Coaxial transistor structure
Disposable radio headset