Resources Contact Us Home
Hermetic encapsulation package and method of fabrication thereof

Image Number 7 for United States Patent #6611098.

A hermetic encapsulation package and a method of fabricating such package, wherein at least one organic electroluminescent (EL) element is formed on a support substrate. A sealing cap for accommodating the organic EL element is bonded to the support substrate with an ultraviolet curing resin to form a sealed space defined by the sealing cap and the support substrate. At least part of the sealing cap is formed of an elastic material of a Young's modulus of 70 GPa or less. The elastic portion of the sealing cap is reversibly deflected to provide a decrease or increase in the volume of the sealed space to reduce pressure changes inside the sealed space caused by changes in temperature, thereby alleviating problems of thermal shock.

  Recently Added Patents
Supplier capability methods, systems, and apparatuses for extended commerce
Lens module and method for manufacturing thereof
Pear-shaped convertible reading glasses
Method and apparatus for encoding and decoding video based on first sub-pixel unit and second sub-pixel unit
Method and system for detecting center pivot collision
Semiconductor device
Method for detecting motion of an electrical device or apparatus
  Randomly Featured Patents
Chip interconnection structure using stub terminals
Remote vehicle starter
System for refining network utilization and data block sizes in the transfer of data over a network
Method and apparatus for controlling the supply of sliver to the spinning stations of a spinning machine
Method for fabricating a capacitor in a semiconductor memory device
Machine tool having improved means for holding workpieces
Method and apparatus for delivery cart movement start and energy recovery
CMOS inverter having temperature and supply voltage variation compensation
Toilet flush valve
Device for measuring and indicating flow around a bend