Resources Contact Us Home
In-situ monitoring of linear substrate polishing operations

Image Number 3 for United States Patent #6585563.

A substrate polishing scheme (apparatus and method) is described according to which a polishing surface of a polishing sheet is driven in a generally linear direction by a drive mechanism, a surface of a substrate is held against the polishing surface of the polishing sheet by a polishing head, and the substrate is probed through the polishing sheet by a monitoring system.

  Recently Added Patents
Automated pizza preparation and vending system
Method for producing organo-oligo silsesquioxanes
Protection circuit, substrate for electro-optical device, electro-optical device, electrophoretic display device, electronic apparatus, and manufacturing method of electro-optical device
Scanning transmission electron microscope and axial adjustment method thereof
Compact light shield for flash photography
Signal conversion control circuit for touch screen and method thereof
Image forming apparatus and method for making density correction in a low resolution image based on edge determination
  Randomly Featured Patents
Inflation tool
BDX data in stable states
Data viewer
Intelligent cable for controlling data flow
GPU assisted 3D compositing
Immunostimulatory oligonucleotide that induces interferon alpha
Protected brittle fiber yarns
Key transformation unit for a tamper resistant module
Tap-hole drilling machine