Resources Contact Us Home
In-situ monitoring of linear substrate polishing operations

Image Number 3 for United States Patent #6585563.

A substrate polishing scheme (apparatus and method) is described according to which a polishing surface of a polishing sheet is driven in a generally linear direction by a drive mechanism, a surface of a substrate is held against the polishing surface of the polishing sheet by a polishing head, and the substrate is probed through the polishing sheet by a monitoring system.

  Recently Added Patents
Method and apparatus for wireless transmission of diagnostic information
Blue box
Asymmetric switching rectifier
Quantitative oxygen imaging systems and methods using echo-based single point imaging
System and method for enhancing buyer and seller interaction during a group-buying sale
Bicyclic azaheterocyclic carboxamides
  Randomly Featured Patents
Load/store ordering in a threaded out-of-order processor
Process for agglomerating sodium carbonate peroxide
Spatter shielding and vapor venting device for frying pan
Method of making encapsulated spacers in vertical pass gate DRAM and damascene logic gates
Antimicrobial solutions and process related thereto
Firearm grip
Process for gentle mixing and coating of superabsorbers
Flower pot cover
Computerized method and system for searching for text passages in text documents