Resources Contact Us Home
In-situ monitoring of linear substrate polishing operations

Image Number 3 for United States Patent #6585563.

A substrate polishing scheme (apparatus and method) is described according to which a polishing surface of a polishing sheet is driven in a generally linear direction by a drive mechanism, a surface of a substrate is held against the polishing surface of the polishing sheet by a polishing head, and the substrate is probed through the polishing sheet by a monitoring system.

  Recently Added Patents
Method of aligning a transmission synchronizer
Workflow based authorization for content access
Methods and systems for differentiating soybeans
Switching power supply control with reduced harmonic frequency fluctuations
Device for promotion of hemostasis and/or wound healing
Room air conditioner and/or heat pump
Image processing device capable of saving ink consumption
  Randomly Featured Patents
Belt buckle
Pavement cutter
Bath accessory
Exhaust gas recirculation system for an internal combustion engine having an integrated vacuum regulator and delta pressure sensor
Device for manufacturing semiconductor device and method of manufacturing the same
Fluorphore embedded/incorporating/bridged periodic mesoporous organosilicas as recognition photo-decontamination catalysts
Method for stabilizing soil and for providing a backfill for grounding members
Method for fabricating concrete blocks or concrete slabs
Semi-automated custom capsule dispensing and assembly machine and method