Resources Contact Us Home
In-situ monitoring of linear substrate polishing operations

Image Number 3 for United States Patent #6585563.

A substrate polishing scheme (apparatus and method) is described according to which a polishing surface of a polishing sheet is driven in a generally linear direction by a drive mechanism, a surface of a substrate is held against the polishing surface of the polishing sheet by a polishing head, and the substrate is probed through the polishing sheet by a monitoring system.

  Recently Added Patents
Substituted indolo 4,3 FG quinolines useful for treating migraine
Group control method for machine type communication and mobile communication system using the method
Electronic device including predicted frequency error estimation of a voltage controlled oscillator and related methods
Secure mobile ad hoc network
Method and system for electronic distribution of product redemption coupons
Picture quality control method and image display using same
Approaching object detection system
  Randomly Featured Patents
Guitar pick
Thumb insertion portion of a baseball mitt
System and method for tissue generation and bone regeneration
Ball contact slip ring assembly
Protective travel case
Method of controlling an aluminum cell with variable alumina dissolution rate
Mop head
Automatic dice shaking apparatus
Semiconductor integrated circuit device
Method for maintaining wavelength-locking of Fabry-Perot laser regardless of change of external temperature and WDM light source using the method