Resources Contact Us Home
In-situ monitoring of linear substrate polishing operations

Image Number 3 for United States Patent #6585563.

A substrate polishing scheme (apparatus and method) is described according to which a polishing surface of a polishing sheet is driven in a generally linear direction by a drive mechanism, a surface of a substrate is held against the polishing surface of the polishing sheet by a polishing head, and the substrate is probed through the polishing sheet by a monitoring system.

  Recently Added Patents
Computer product, information retrieval method, and information retrieval apparatus
Header rail for a shower screen or the like
Image stabilization apparatus and image pickup apparatus
Multi-wired antenna for mobile apparatus
Disk drive to enable defect margining
Nonvolatile semiconductor memory device and method for controlling the same
Pressure-sensitive adhesive composition for optical films, pressure-sensitive adhesive optical film and image display
  Randomly Featured Patents
Method and apparatus for calibration over time of histological and physiological biometric markers for authentication
Label having transparent and opaque areas
Miter gauge
Method for forming a semiconductor structure using a disposable hardmask
Steering system for a utility vehicle
Table clock
Loading wheel for integrated circuit packing band
Process for the production of supported palladium-gold catalysts
Correcting motion vector maps for image processing
Transmit frequency precorrection for satellite terminals