Resources Contact Us Home
In-situ monitoring of linear substrate polishing operations

Image Number 3 for United States Patent #6585563.

A substrate polishing scheme (apparatus and method) is described according to which a polishing surface of a polishing sheet is driven in a generally linear direction by a drive mechanism, a surface of a substrate is held against the polishing surface of the polishing sheet by a polishing head, and the substrate is probed through the polishing sheet by a monitoring system.

  Recently Added Patents
Automatically selecting a paper with increased dimensions than originally desired for printing and adding advertisement content to the increased dimensional area of the paper
Adaptive take-off strips for smoothing ink consumption
Processing color and panchromatic pixels
Information-provision control method, information reproduction system, information-provision apparatus, information reproduction apparatus and information-presentation control program
Identification of protected content in e-mail messages
Controller for machine tool and five-axis simultaneous control machine tool controlled thereby
System and method for multi-threaded OFDM channel equalizer
  Randomly Featured Patents
Air conditioner
Rowing exercise device
Automatic soil moisture sensing and watering system
Process and apparatus for detecting a loss of reaction in a hydrocarbon conversion reaction
Light emitting device and method of manufacturing the same
Process for producing quinazolin-4-one and derivatives thereof
Delay lines, methods for delaying a signal, and delay lock loops
Laser microscope
Trash can
Adhesive for difficult to bond surfaces