Resources Contact Us Home
Method of polishing a layer comprising copper using an oxide inhibitor slurry

Image Number 3 for United States Patent #6566266.

A process for polishing a semiconductor body according to an embodiment of the present invention includes the steps of providing a semiconductor body, forming a barrier layer over a portion of the semiconductor body, and forming at least one layer including copper over a portion of the barrier layer. The process further includes the steps of polishing at least a portion of the layer including copper with a first polishing slurry composition and changing the polishing composition from the first slurry composition to a second polishing slurry composition. The process also includes the steps of polishing at least a portion of the layer including copper with the second slurry composition and polishing at least a portion of the barrier layer with the second slurry composition. Moreover, the second slurry composition includes an effective amount of a copper oxide inhibitor to substantially inhibit copper oxide formation. In an embodiment, the effective amount of the copper oxide inhibitor is between about 0.005% and 0.03% by weight of the second slurry composition. In another embodiment, the second slurry composition is different than the first slurry composition.

  Recently Added Patents
Fabric care compositions comprising front-end stability agents
Automated tuning in a virtual machine computing environment
Additives for oil recovery from reservoirs
Generation of uniform fragments of nucleic acids using patterned substrates
Vehicle seating system and method for reducing fatigue with changing actuator movement
Reducing voltage stress in a flyback converter design
Jacket liner
  Randomly Featured Patents
Relief printing plate manufacture
Petunia plant named `DANCASBIF1`
Cross-crawl chair
Combination nonvolatile memory using unified technology with byte, page and block write and simultaneous read and write operations
IR receiver using IR transmitting diode
Athletic or other performance sensing systems
Method for forming a multi-layer low-K dual damascene
Lignan formulations
Key input device
Low cost thermal insulation for a fuel cell stack integrated end unit