Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies










Image Number 3 for United States Patent #6548757.

Microelectronic devices having a protected input and methods for manufacturing such microelectronic devices. A microelectronic device has a microelectronic die and a support structure for coupling the die to voltage and signal sources. The microelectronic die can have integrated circuitry and a plurality of bond-pads coupled to the integrated circuitry. The bond-pads, for example, can include a reference voltage (Vref) bond-pad and a signal bond-pad adjacent to the Vref bond-pad. The signal bond-pad can be for a clock signal, a data signal, a strobe signal, an address signal, or another type signal for operating the integrated circuitry. The support structure can be a lead frame or a interposing substrate having a plurality of conductive members coupled to the bond-pads of the die. The conductive members can accordingly be metal pins in the case of lead frames or traces and solder ball-pads in the case of interposing substrates. Each conductive member can have a first end with a bond-site proximate to a corresponding bond-pad of the die, a second end defining an external connector, and an elongated conductive section connecting the bond-site to the external connector. The conductive members are generally arranged so that at least some of the bond-sites are arranged in a first row in which the bond-sites and a portion of the elongated sections are spaced apart from one other by a first gap width. The support structure can more specifically include a first conductive member having a first bond-site coupled to the Vref bond-pad by a first wire-bond line and a second conductive member having a second bond-site coupled to the signal bond-pad by a second wire-bond line. The first bond-site of the first conductive member can be spaced apart from the second bond-site of the second conductive member by a second gap width greater than the first gap width.








 
 
  Recently Added Patents
Switching device and electronic apparatus using the same
Method and system for the geolocation of a radio beacon in a search and rescue system
Vectorization of program code
Power management method for reducing power of host when turning off main monitor and computer system applying the same
Micro vein enhancer
Radiation imaging device
2,2'-binaphthalene ester chiral dopants for cholesteric liquid crystal displays
  Randomly Featured Patents
Room temperature cure latices
Dual-bandwidth cellular telephone switching apparatus
Vibratory core for concrete pipe making machine
Efficient key derivation for end-to-end network security with traffic visibility
Mask type color television tube and method of manufacturing the same
Silver halide wash-out elements
4-Stilbenyl-1,2,3-triazoles, process for preparing them and their use as optical brighteners
Air bag fastener
Fluorescent lamp socket
Hydroelectric installation and method of constructing same