Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies










Image Number 3 for United States Patent #6548757.

Microelectronic devices having a protected input and methods for manufacturing such microelectronic devices. A microelectronic device has a microelectronic die and a support structure for coupling the die to voltage and signal sources. The microelectronic die can have integrated circuitry and a plurality of bond-pads coupled to the integrated circuitry. The bond-pads, for example, can include a reference voltage (Vref) bond-pad and a signal bond-pad adjacent to the Vref bond-pad. The signal bond-pad can be for a clock signal, a data signal, a strobe signal, an address signal, or another type signal for operating the integrated circuitry. The support structure can be a lead frame or a interposing substrate having a plurality of conductive members coupled to the bond-pads of the die. The conductive members can accordingly be metal pins in the case of lead frames or traces and solder ball-pads in the case of interposing substrates. Each conductive member can have a first end with a bond-site proximate to a corresponding bond-pad of the die, a second end defining an external connector, and an elongated conductive section connecting the bond-site to the external connector. The conductive members are generally arranged so that at least some of the bond-sites are arranged in a first row in which the bond-sites and a portion of the elongated sections are spaced apart from one other by a first gap width. The support structure can more specifically include a first conductive member having a first bond-site coupled to the Vref bond-pad by a first wire-bond line and a second conductive member having a second bond-site coupled to the signal bond-pad by a second wire-bond line. The first bond-site of the first conductive member can be spaced apart from the second bond-site of the second conductive member by a second gap width greater than the first gap width.








 
 
  Recently Added Patents
Method of estimating remaining constant current/constant voltage charging time
Method and system for controlled media sharing in a network
(-)-epigallocatechin gallate derivatives for inhibiting proteasome
Electronic device
Wireless network device including a polarization and spatial diversity antenna system
System and methods for weak authentication data reinforcement
Information processing apparatus and power supply controlling method
  Randomly Featured Patents
Display apparatus and method for controlling the same
1,3,8-Triazaspirodecane-4-ones, pharmaceutical compositions thereof and method of use thereof
Data processing apparatus, data processing method, program, and integrated circuit
Lightweight high stiffness composites having class A surface finish
Steering system having multiple strategies and variable deadzone
Night light
Electrical connector apparatus
Galvanic cell
Packet switching equipment and switching control method
Bituminous compositions prepared from thermoplastic polyolefins and their uses