Resources Contact Us Home
Mounting method of semiconductor element

Image Number 13 for United States Patent #6531022.

A mounting method of a semiconductor element capable of joining an electrode of a semiconductor element and a circuit board at high reliability. The method includes a step of forming an external electrode terminal by filling a hole formed in circuit board with a conductive paste, a step of positioning the external electrode terminal and a protruding bump formed on an electrode of a semiconductor, and a step of pressing the semiconductor element to contact between the conductive paste in the hole and the protruding bump thereby electrically connecting the electrode of the semiconductor element and the external electrode terminal of the circuit board. An adhesive sheet of a thermosetting resin, a thermoplastic resin, or a mixed thermosetting and thermoplastic resin may be disposed on the circuit board where the bump breaks through the sheet to contact the paste.

  Recently Added Patents
Distylium plant named `PIIDIST-II`
Memory access monitoring method and device
Active constant power supply apparatus
RF amplifier with digital filter for polar transmitter
Turbulence sensor and blade condition sensor system
Probiotic enriched and low organic acid food products
Molten alloy solidification analyzing method and solidification analyzing program for performing the same
  Randomly Featured Patents
Auto-return batting tee
Process for producing interior trims for transport means and interior trims produced in this process
Injection moulding machine
System for keeping account of predetermined homogenous units
Charge domain bit serial vector-matrix multiplier and method thereof
Read signal processing circuit
Electronic writing instrument, computer system, electronic writing method and computer readable medium
Techniques of imperceptibly altering the spectrum of a displayed image in a manner that discourages copying
Low insertion force receptacle and cammed housing
Undercarriage control system