Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Mounting method of semiconductor element










Image Number 13 for United States Patent #6531022.

A mounting method of a semiconductor element capable of joining an electrode of a semiconductor element and a circuit board at high reliability. The method includes a step of forming an external electrode terminal by filling a hole formed in circuit board with a conductive paste, a step of positioning the external electrode terminal and a protruding bump formed on an electrode of a semiconductor, and a step of pressing the semiconductor element to contact between the conductive paste in the hole and the protruding bump thereby electrically connecting the electrode of the semiconductor element and the external electrode terminal of the circuit board. An adhesive sheet of a thermosetting resin, a thermoplastic resin, or a mixed thermosetting and thermoplastic resin may be disposed on the circuit board where the bump breaks through the sheet to contact the paste.








 
 
  Recently Added Patents
Front exterior of an automotive tail lamp
Ascertaining presentation format based on device primary control determination
Television with a stand
Semiconductor apparatus
System and method for operating an electric power converter
Direct connect single layer touch panel
Solid-state imaging device and imaging apparatus
  Randomly Featured Patents
Method of and apparatus for performing continuous hydrothermal synthesis
Method for making video discs and video disc molds
Device for inserting transport anchors in forms for concrete parts
Low clearance centralizer
Method for assessing image focus quality
Stapling device
Portion of a trigger for trigger pump dispenser
Flat bottomed shoe sole with a false arch bridge
Controlled release container with core and outer shell
Impact wrench