Resources Contact Us Home
Mounting method of semiconductor element

Image Number 13 for United States Patent #6531022.

A mounting method of a semiconductor element capable of joining an electrode of a semiconductor element and a circuit board at high reliability. The method includes a step of forming an external electrode terminal by filling a hole formed in circuit board with a conductive paste, a step of positioning the external electrode terminal and a protruding bump formed on an electrode of a semiconductor, and a step of pressing the semiconductor element to contact between the conductive paste in the hole and the protruding bump thereby electrically connecting the electrode of the semiconductor element and the external electrode terminal of the circuit board. An adhesive sheet of a thermosetting resin, a thermoplastic resin, or a mixed thermosetting and thermoplastic resin may be disposed on the circuit board where the bump breaks through the sheet to contact the paste.

  Recently Added Patents
System and method for customized prompting
Method and apparatus for controllable communication
Cross-linkable compositions
Processor and data transfer method
Sending targeted product offerings based on personal information
Electronic device, communication control method of electronic device, and information terminal device
  Randomly Featured Patents
Extended stem globe valve
Door handle motion transfer mechanism
Protective barrier
Logarithmic digital to analog converter
Active hopper for promoting flow of bulk granular or powdered solids
Apparatus and method for measuring and recording data from violent events
Cable for high speed data communications
Bioadhesive composition
Loader tray for eliminating vibration and resonance effect
Spirit level