Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Mounting method of semiconductor element










Image Number 13 for United States Patent #6531022.

A mounting method of a semiconductor element capable of joining an electrode of a semiconductor element and a circuit board at high reliability. The method includes a step of forming an external electrode terminal by filling a hole formed in circuit board with a conductive paste, a step of positioning the external electrode terminal and a protruding bump formed on an electrode of a semiconductor, and a step of pressing the semiconductor element to contact between the conductive paste in the hole and the protruding bump thereby electrically connecting the electrode of the semiconductor element and the external electrode terminal of the circuit board. An adhesive sheet of a thermosetting resin, a thermoplastic resin, or a mixed thermosetting and thermoplastic resin may be disposed on the circuit board where the bump breaks through the sheet to contact the paste.








 
 
  Recently Added Patents
Imaging apparatus for calculating a histogram to adjust color balance
Method and apparatus for over-the-air activation of neighborhood cordless-type services
Image capture system and method
Permutational memory cells
Cable preparation tool
Mobile device case with storage compartment
Organic electroluminescent element
  Randomly Featured Patents
Hydraulically operated clam bucket with improved force transferring arrangement
Method of controlling transmission for vehicle
Reformulated gasolines and methods of producing reformulated gasolines
Process for introducing an insulating system in an interspace
Fluid-filled decorative element for a child's shoe
System for pumping fluids from horizontal wells
Chemiluminescent device
Sub-lithographic gate length transistor using self-assembling polymers
Wire drawing die
Method of making an embedded-object and composite-material product