Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Mounting method of semiconductor element










Image Number 13 for United States Patent #6531022.

A mounting method of a semiconductor element capable of joining an electrode of a semiconductor element and a circuit board at high reliability. The method includes a step of forming an external electrode terminal by filling a hole formed in circuit board with a conductive paste, a step of positioning the external electrode terminal and a protruding bump formed on an electrode of a semiconductor, and a step of pressing the semiconductor element to contact between the conductive paste in the hole and the protruding bump thereby electrically connecting the electrode of the semiconductor element and the external electrode terminal of the circuit board. An adhesive sheet of a thermosetting resin, a thermoplastic resin, or a mixed thermosetting and thermoplastic resin may be disposed on the circuit board where the bump breaks through the sheet to contact the paste.








 
 
  Recently Added Patents
Method to dynamically tune precision resistance
Image forming apparatus capable of timely starting different image formation mode
Process for producing polyphenylene ether composition
Method and system for filtering home-network content
Wrench
Fuel cell module
Apparatus and method for controlling a tunable matching network in a wireless network
  Randomly Featured Patents
Portable information terminal
Method for controlling fluid flow in a rotational atherectomy device
Imaging apparatus, image processing method, and computer program product for preventing false motion vector detection
Apparatus for applying viscous material
Lavatory table
Open shelf unit
Software methods of an optical networking apparatus with multiple multi-protocol optical networking modules having packet filtering resources
HP turbine vane airfoil profile
Turf lifting tool or the like
Organic light emitting device