Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Mounting method of semiconductor element










Image Number 13 for United States Patent #6531022.

A mounting method of a semiconductor element capable of joining an electrode of a semiconductor element and a circuit board at high reliability. The method includes a step of forming an external electrode terminal by filling a hole formed in circuit board with a conductive paste, a step of positioning the external electrode terminal and a protruding bump formed on an electrode of a semiconductor, and a step of pressing the semiconductor element to contact between the conductive paste in the hole and the protruding bump thereby electrically connecting the electrode of the semiconductor element and the external electrode terminal of the circuit board. An adhesive sheet of a thermosetting resin, a thermoplastic resin, or a mixed thermosetting and thermoplastic resin may be disposed on the circuit board where the bump breaks through the sheet to contact the paste.








 
 
  Recently Added Patents
Membrane electrode assembly and methods for making same using release paper and an incision part
Open platform hybrid manual-automated sample processing system
Method and apparatus for power control in a wireless communication system
Drilling fluid and methods
Intravascular indwelling catheter lock solution containing weak acid and container containing the same
Wearable binoculars
Method and apparatus for producing triangular waveform with low audio band noise content
  Randomly Featured Patents
Synchronous motor with permanent magnet provided on magnetic pole end
Method of making dried extruded gnocchi
Bear craft wire
Tarpaulin tensioning arrangement
Air compressor based vehicle drive system
Automatic stir-fry machine
SISP-1, a novel p53 target gene and use thereof
Device for limiting the flapping movements of a rotary-wing aircraft main rotor
Protection of data on media recording disks
Stirling-based heating and cooling device