Resources Contact Us Home
Arrangement relating to electronic circuitry

Image Number 3 for United States Patent #6501181.

The present invention relates to an arrangement in a multilayered electronic circuit. In a transition between two planar transmission lines, a compensating element is used to keep the average capacitance per length unit more constant during the transition. A via conductor the passes near an edge of a planar conductor pattern, the via conductor and the planar conductor having a mutual capacitive coupling within a predetermined range. A compensating conductor is formed between the planar conductor and the via conductor, which conductor is connected to the planar conductor by a compensating via. If the segment of the via conductor which belongs to the same via hole pattern as the compensating via is displaced, the compensating via is also displaced. The compensating planar pattern is then disconnected from the planar conductor. This improves yield in a given multilayer process.

  Recently Added Patents
Display screen or portion thereof with graphical user interface
Method for radiation sterilization of medical devices
Dual source mass spectrometry system
Method and apparatuses for solving weighted planar graphs
Resist underlayer film forming composition for lithography, containing aromatic fused ring-containing resin
Profile-based user access to a network management system
Method and apparatus for accessing coconut water
  Randomly Featured Patents
Foil web for filling automats with a removal apparatus
Bulk pre-measured single hand dispenser
Methods and means for obtaining modified phenotypes
Casino card game
Electrical evaporator with adjustable evaporation intensity
Monolithic optical fiber coupler including sleeve with flexible flap
Semiconductor substrate and method of manufacturing semiconductor device
System and method for weighting configuration item relationships supporting business critical impact analysis
Central frame of a connecting corridor bellows subdivided in two halves
Article obtained by injection molding