Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Ultra-thin semiconductor package device using a support tape










Image Number 5 for United States Patent #6498389.

An ultra-thin semiconductor package device comprises a heat-resistant film-type adhesive support tape which connects a semiconductor chip to a plurality of individual lead frames, wherein each lead frame is connected to an associated one of a plurality of electrode pads of the semiconductor chip by a plurality of bonding wires. An encapsulating molding material provides environmental protection for the completed package. Within the encapsulating molding, the semiconductor chip is mounted on a same underside of the support tape as the plurality of lead frames, such that the bottom of the semiconductor chip is aligned with the bottom of an encapsulating molding, and the height of a loop in each bonding wire is minimized.








 
 
  Recently Added Patents
Content distribution system, mobile communication terminal device, and computer readable medium
Techniques for data assignment from an external distributed file system to a database management system
Wake-up radio system
Large carrying case
Phosphor, light emitting apparatus, and liquid crystal display apparatus using the same
Switch redundancy in systems with dual-star backplanes
Method for forming contact hole
  Randomly Featured Patents
Valve system for introducing objects into anatomical body portions
Apparatus and method of regulating the temperature of solid fuel stoves
Keyboard tray with adjustable wrist support
Earth reference thin-film magnetometer compass exhibiting total tilt immunity
Recycling polyolefins coated with chlorine-containing polymer
Optical fibre back plane
Adaptive subpixel-based downsampling and filtering using edge detection
Electronic tube with simplified collector
Roaster
3-Hydroxy-4-methoxyphenyl benzoates