Resources Contact Us Home
Ultra-thin semiconductor package device using a support tape

Image Number 5 for United States Patent #6498389.

An ultra-thin semiconductor package device comprises a heat-resistant film-type adhesive support tape which connects a semiconductor chip to a plurality of individual lead frames, wherein each lead frame is connected to an associated one of a plurality of electrode pads of the semiconductor chip by a plurality of bonding wires. An encapsulating molding material provides environmental protection for the completed package. Within the encapsulating molding, the semiconductor chip is mounted on a same underside of the support tape as the plurality of lead frames, such that the bottom of the semiconductor chip is aligned with the bottom of an encapsulating molding, and the height of a loop in each bonding wire is minimized.

  Recently Added Patents
Bi-fuel engine
Reconstruction method using direct and iterative techniques
System and method for handling data transfers
Apparatus and method for operation according to squeezing in portable terminal
Methods utilizing supplemental module for backward and/or cross-platform compatibility
Cover for liquid container
Transmission of multimedia contents to a plurality of mobile users
  Randomly Featured Patents
Safety utensils for infants and small children
Taffy-like chewing gum confection and method
Sulfoximine and suldodiimine matrix metalloproteinase inhibitors
Diagnostic test strip for collecting and detecting an analyte in a fluid sample and method for using the same
Mass of current inrush limiters
Method for depositing a protective carbon coating on a data recording disk
Electric cooker having a composite heat source
Process for preventing vibrations of cylinders in a cylinder conveyor
2',3'-dideoxy-2'-fluoroarabinopyrimidine nucleosides
Bicycle side-suspension system