Resources Contact Us Home
Ultra-thin semiconductor package device using a support tape

Image Number 5 for United States Patent #6498389.

An ultra-thin semiconductor package device comprises a heat-resistant film-type adhesive support tape which connects a semiconductor chip to a plurality of individual lead frames, wherein each lead frame is connected to an associated one of a plurality of electrode pads of the semiconductor chip by a plurality of bonding wires. An encapsulating molding material provides environmental protection for the completed package. Within the encapsulating molding, the semiconductor chip is mounted on a same underside of the support tape as the plurality of lead frames, such that the bottom of the semiconductor chip is aligned with the bottom of an encapsulating molding, and the height of a loop in each bonding wire is minimized.

  Recently Added Patents
Power generating apparatus of renewable energy type and method of attaching and detaching blade
Method for switching between virtualized and non-virtualized system operation
Peer-to-peer, internet protocol telephone system with proxy interface for configuration data
Sensor system
TRPM8 antagonists and their use in treatments
System for encrypting and decrypting a plaintext message with authentication
Generalized AC-DC synchronous rectification techniques for single- and multi-phase systems
  Randomly Featured Patents
Scrap stripper for a rotary cutting device for cutting corrugated board
Safety device and system for window covering pull cords
Method for manufacturing a magnetic recording member
Highly compacted animal food system
Motorized wheel chair
Friction joint and fastener incorporating same
Ball thrower
Method of manufacturing aluminum nitride
Adaptable resilient motor mounting
Thermal cracking of shale oil