Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Ultra-thin semiconductor package device using a support tape










Image Number 5 for United States Patent #6498389.

An ultra-thin semiconductor package device comprises a heat-resistant film-type adhesive support tape which connects a semiconductor chip to a plurality of individual lead frames, wherein each lead frame is connected to an associated one of a plurality of electrode pads of the semiconductor chip by a plurality of bonding wires. An encapsulating molding material provides environmental protection for the completed package. Within the encapsulating molding, the semiconductor chip is mounted on a same underside of the support tape as the plurality of lead frames, such that the bottom of the semiconductor chip is aligned with the bottom of an encapsulating molding, and the height of a loop in each bonding wire is minimized.








 
 
  Recently Added Patents
Method and assembly for determining the temperature of a test sensor
Photon density wave based determination of physiological blood parameters
Error correct coding device, error correct coding method, and error correct coding program
Spalling utilizing stressor layer portions
Virtual billboards
Electron beam manipulation system and method in X-ray sources
Motor drive component verification system and method
  Randomly Featured Patents
Dual-in-line plug and socket assemblies
Dahlia plant name `Gallery Art Fair`
Zeolite catalyst with enhanced dealkylation activity and method for producing same
Direct analysis of paraffin and naphthene types in hydrocarbon
Ultrasonic pest repelling device
Apparatus and method for store address for store address prefetch and line locking
Apparatus and method for multi-level cache utilization
Radiation measurement device
Dynamic transcoding to stitch streaming digital content
Methods of designing an integrated circuit on corrugated substrate