Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Ultra-thin semiconductor package device using a support tape










Image Number 5 for United States Patent #6498389.

An ultra-thin semiconductor package device comprises a heat-resistant film-type adhesive support tape which connects a semiconductor chip to a plurality of individual lead frames, wherein each lead frame is connected to an associated one of a plurality of electrode pads of the semiconductor chip by a plurality of bonding wires. An encapsulating molding material provides environmental protection for the completed package. Within the encapsulating molding, the semiconductor chip is mounted on a same underside of the support tape as the plurality of lead frames, such that the bottom of the semiconductor chip is aligned with the bottom of an encapsulating molding, and the height of a loop in each bonding wire is minimized.








 
 
  Recently Added Patents
Probe card holding apparatus with probe card engagement structure
Maize variety hybrid X13A495
Digital processing method and system for determination of optical flow
Resist composition and method for producing resist pattern
Method and system for parallelizing data copy in a distributed file system
Image browsing device, computer control method and information recording medium
Method and device for synthesizing image
  Randomly Featured Patents
Presence detection for IP telephony
Prevention and treatment of sub-clinical PCVD
Tensioning device for an internal high-pressure forming tool
Method and apparatus for determining moisture content of materials
Curable resin composition, paint using the same, and coat-finishing method
Microemulsions with adsorbed macromolecules and microparticles
Holder for compact discs
Method for producing formoxysilane
Juice concentrate package for postmix dispenser
Position and orientation measurement method and apparatus