Resources Contact Us Home
Ultra-thin semiconductor package device using a support tape

Image Number 5 for United States Patent #6498389.

An ultra-thin semiconductor package device comprises a heat-resistant film-type adhesive support tape which connects a semiconductor chip to a plurality of individual lead frames, wherein each lead frame is connected to an associated one of a plurality of electrode pads of the semiconductor chip by a plurality of bonding wires. An encapsulating molding material provides environmental protection for the completed package. Within the encapsulating molding, the semiconductor chip is mounted on a same underside of the support tape as the plurality of lead frames, such that the bottom of the semiconductor chip is aligned with the bottom of an encapsulating molding, and the height of a loop in each bonding wire is minimized.

  Recently Added Patents
Output device, source apparatus, television set, system, output method, program, and recording medium
Multi-bank queuing architecture for higher bandwidth on-chip memory buffer
Dual work function recessed access device and methods of forming
Character input device and program for displaying next word candidates based on the candidates' usage history
Method for generating codewords
Process for the enzymatic reduction of enoates
Nonvolatile semiconductor memory device and method of manufacturing the same
  Randomly Featured Patents
Seat belt fastening device
Structural family on non-ionic carbohydrate based surfactants (NICBS) and a novel process for their synthesis
Controlled conversion of metal oxyfluorides into superconducting oxides
Press-on shelf support system
Method of making an automobile roof cap
Image transfer device
Programmable multi-chip module
Portable belt sander
Filter assembly machine cigarette sampling unit
Business logic server for facilitating the transmission of a data download to a mobile wireless unit