Resources Contact Us Home
Ultra-thin semiconductor package device using a support tape

Image Number 5 for United States Patent #6498389.

An ultra-thin semiconductor package device comprises a heat-resistant film-type adhesive support tape which connects a semiconductor chip to a plurality of individual lead frames, wherein each lead frame is connected to an associated one of a plurality of electrode pads of the semiconductor chip by a plurality of bonding wires. An encapsulating molding material provides environmental protection for the completed package. Within the encapsulating molding, the semiconductor chip is mounted on a same underside of the support tape as the plurality of lead frames, such that the bottom of the semiconductor chip is aligned with the bottom of an encapsulating molding, and the height of a loop in each bonding wire is minimized.

  Recently Added Patents
Self-adjusting email subject and email subject history
Optimized flash based cache memory
System and method for diagnosing onset of osteoarthritis
Configuring host settings to specify an encryption setting and a key label referencing a key encryption key to use to encrypt an encryption key provided to a storage drive to use to encrypt da
Crunching dynamically generated script files
Light cover
Collapsible bag for automotive cup holder
  Randomly Featured Patents
Cargo nets and fittings therefor
Dual port semiconductor memory device with high speed data transfer during reading and writing modes
Hypochlorite destruction using urea
Light control device, lighting device, and projector for controlling transmission amount of light emitted from an emission area by use of curved light shielding members
Brake system with brake gain shifting
Dental matrix band
Toothbrush handle with tissue cleaner
Removal of aldehydes from .alpha., .beta.-olefinically unsaturated carboxylic acids
Apparatus and method for periodically applying a pressure waveform to a limb
Display canopy