Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Ultra-thin semiconductor package device using a support tape










Image Number 5 for United States Patent #6498389.

An ultra-thin semiconductor package device comprises a heat-resistant film-type adhesive support tape which connects a semiconductor chip to a plurality of individual lead frames, wherein each lead frame is connected to an associated one of a plurality of electrode pads of the semiconductor chip by a plurality of bonding wires. An encapsulating molding material provides environmental protection for the completed package. Within the encapsulating molding, the semiconductor chip is mounted on a same underside of the support tape as the plurality of lead frames, such that the bottom of the semiconductor chip is aligned with the bottom of an encapsulating molding, and the height of a loop in each bonding wire is minimized.








 
 
  Recently Added Patents
Motion estimation for a video transcoder
Cardiopulmonary resuscitation monitoring apparatus
Glass or glass-ceramic pane reflecting infrared radiation
Curable inks comprising surfactant-coated magnetic nanoparticles
Pressure washer
Light barrier and method for detecting objects
Interaction analysis and prioritization of mobile content
  Randomly Featured Patents
Nuclear reactor downcomer flow deflector
Method and apparatus for producing a three-dimensional curved surface from two-dimensional curves in perpendicular planes
System and method for providing access to and managing account activity for an online account
Container
Nozzle with magnetically actuated reciprocating plunger
Message door lock apparatus
Combined differential gear device
Role grouping of hosts in computer networks
Method and apparatus for morphology-based arrhythmia classification using cardiac and other physiological signals
Model merger using an export map