Resources Contact Us Home
Method of transferring substrates with two different substrate holding end effectors

Image Number 7 for United States Patent #6481956.

A method of transferring semi-conductor substrates from a first location to a second location. The first and second locations are adapted to hold a plurality of the substrates in individual support area. The method comprises use of a transfer mechanism with two substrate holding end effectors which each have support areas adapted to individually support different maximum numbers of substrates thereon. The substrates are transferred from the first location to the second location with the first end effector and, when empty individual support areas in the second location or substrates at the first location are less than the maximum number of support areas on the first end effector, transferring substrates from the first location to the second location with use of the second end effector.

  Recently Added Patents
Organic elelectroluminescent display
Opportunistic modem
Detection of procedural deficiency across multiple business applications
In-store marketing sign
Motor assembly
Enediyne compounds, conjugates thereof, and uses and methods therefor
Organic light emitting device connection methods
  Randomly Featured Patents
Rational selection of putative peptides from identified nucleotide, or peptide sequences, of unknown function
Modeling operating system instances
Dielectric filter, dielectric duplexer, and communication apparatus incorporating the same
Digital printing apparatus
Spark plug connector
Spring piston air weapon
Hybridization assay using self-quenching fluorescence probe
Preparation of 1,2,3-tris[1,2-bis(difluoramino)ethoxy]propane
Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the composition
Method and apparatus for electrodeposition of a metallurgically bondable circuitized flexible substrate