Resources Contact Us Home
Method of transferring substrates with two different substrate holding end effectors

Image Number 7 for United States Patent #6481956.

A method of transferring semi-conductor substrates from a first location to a second location. The first and second locations are adapted to hold a plurality of the substrates in individual support area. The method comprises use of a transfer mechanism with two substrate holding end effectors which each have support areas adapted to individually support different maximum numbers of substrates thereon. The substrates are transferred from the first location to the second location with the first end effector and, when empty individual support areas in the second location or substrates at the first location are less than the maximum number of support areas on the first end effector, transferring substrates from the first location to the second location with use of the second end effector.

  Recently Added Patents
Bessel beam plane illumination microscope
Display unit and display method
Permitting access of slave device from master device based on process ID's
Bird deterrent
Fuel cell module, manufacturing method thereof and unit containing several of the latter
Drive coil, measurement probe comprising the drive coil and methods utilizing the measurement probe
Circuit and method for generating an AC voltage from a plurality of voltage sources having a temporally variable DC output voltage
  Randomly Featured Patents
Pouring method and apparatus therefor
Hybrid semiconductor imaging device having plural readout substrates
Method and apparatus for fabricating three dimensional objects from photoformed precursor sheets
Apparatus for separation of material of heterogeneous character
Surface pattern for a paper product
Method for fabricating a low polarization mode dispersion optical fiber
Standardized recreational vehicle sanitary system
Paper guiding device in a copying apparatus
Method for treatment of premenstrual syndrome