Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages










Image Number 19 for United States Patent #6462274.

Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.








 
 
  Recently Added Patents
Process and intermediates for preparing lapatinib
Devices, systems, and methods for tactile feedback and input
High productivity single pass scanning system
Mobile advertising and compensation-verification system
Polymers derived from benzobis(silolothiophene) and their use as organic semiconductors
Prompt gap varying optical filter, analytical instrument, optical device, and characteristic measurement method
Semiconductor device
  Randomly Featured Patents
Screening machine
Battery voltage regulating and condition indicating circuit for measuring instruments
Picture frame clamp
Load sensor having hourglass-shaped coil spring
Water mattress lining and sheeting system
Methods for detecting calpain activation and identifying calpain inhibitors
Hydraulic circuit device
Exhaustible cooler and solar powered warmer
Method of fabricating tubular structure from hybrid material
Physical exercise stick