Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages










Image Number 19 for United States Patent #6462274.

Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.








 
 
  Recently Added Patents
Memory system with data line switching scheme
Discharge circuit and method
Phase-amplitude 3-D stereo encoder and decoder
Sporting goal practice screen
Methods circuits apparatuses and systems for facilitating access to online content
Techniques for generating and displaying a visual flow of user content through a social network
Cryptographically generated addresses using backward key chain for secure route optimization in mobile internet protocol
  Randomly Featured Patents
Hair straightener
Use of barium chromate as a sulfate scavenger in chromium electroplating baths
Method and apparatus of ultrasonic gang welding
Method for preparing a finished concrete part
Low silver dental amalgam alloy composition
Corticotropin-releasing hormone receptor
Tire tread
Recording disk data playback apparatus
Branch target buffer with entry source field for use in determining replacement priority
Telephone answering machine in paging systems with automatic number identification based message operations