Resources Contact Us Home
Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages

Image Number 19 for United States Patent #6462274.

Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.

  Recently Added Patents
Driving system of display panel having a circuit of a voltage generator and driving method thereof
Anti-reductive high-frequency ceramic dielectric material sintered at low temperature and matched with copper internal electrode
Measuring device and measuring method that use pulsed electromagnetic wave
Integrated circuit packaging system with interconnects and method of manufacture thereof
Error recovery storage along a memory string
System, method and computer program product for sharing a single instance of a database stored using a tenant of a multi-tenant on-demand database system
Cycloalkylamine substituted isoquinoline derivatives
  Randomly Featured Patents
Strewing apparatus for garden use
Solid state image pickup device
Illumination optical system and projection display optical system
Electric motor with carbon track commutator
Automatic shutoff liquid dispensing valve
Dual pivoted member mount for mirror
Signal processing apparatus and methods
Method of adhering substrates
Apparatus and method for digital to analog signal conversion using an analog to digital signal converter
Energy conservation system using current control