Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages










Image Number 19 for United States Patent #6462274.

Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.








 
 
  Recently Added Patents
Support for a parameterized query/view in complex event processing
Lighting control device and lighting control method
Egg separator
Selection of hash lookup keys for efficient retrieval
Focus adjustment unit and optical scanning microscope
Flip-chip mounting resin composition and bump forming resin composition
Controlling a resource demand system
  Randomly Featured Patents
Hydraulic circuit for use in wireline formation tester
Plating method and apparatus using contactless electrode
Base material processing device and base material processing method using the same
Charged-particle beam apparatus
Method for the provision of operator-specific performance features of different mobile radio network operators for a mobile radio customer
Waveform improving apparatus
Polyurethane self-priming topcoats
Holder for eyeglasses
Coordinate-measuring machine
Communication macro composer