Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages










Image Number 19 for United States Patent #6462274.

Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.








 
 
  Recently Added Patents
Charged-particle beam lens
Automatically capturing images that include lightning
System, method and program product for guiding correction of semantic errors in code using collaboration records
Methods of diagnosing a plasmodium infection
Ice data collection system
Gas sensor with a porous layer that detectably affects a surface lattice resonant condition of a nanoparticle array
Image forming apparatus and warming up method thereof
  Randomly Featured Patents
Ambulating knee joint
Information recording medium
Electrical connection box
Electronically zoned remote actuated device
Adder having reduced number of internal layers and method of operation thereof
Shake preventing construction for a terminal fitting and a connector
Fault sensing wire and alarm apparatus
Remote-controlled circuit breaker
Electrophotographic carrier particles coated with polymer mixture
Antimicrobial agents