Resources Contact Us Home
Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages

Image Number 19 for United States Patent #6462274.

Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.

  Recently Added Patents
Method for spore detection
Automatic logical position adjustment of multiple screens
Pear-shaped convertible reading glasses
Plants and seeds of hybrid corn variety CH514730
System or method to assist and automate an information security classification and marking process for government and non-government organizations for information of an electronic document
  Randomly Featured Patents
High performance golf ball having a reduced-distance
Method and apparatus for storing call feature data
Process for producing a piezoelectric film, film forming apparatus, and piezoelectric film
Method and system for automatically generating source code based on a mark-up language message definition
Composition for regulating lipid metabolism
Motion sensor, method, and computer-readable storage medium providing a motion sensor with a validated output signal from the motion sensor
Sizing mechanism
Pressurized relief tank for steam
Electrotherapy device using low frequency magnetic pulses
Mold clamping mechanism for glass container forming machine