Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages










Image Number 19 for United States Patent #6462274.

Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.








 
 
  Recently Added Patents
Compositions substantially free of sodium chloride and methods for the storage of red blood cells
Methods and systems for managing electronic messages
Systems and methods for implementing multi-application tabs and tab sets
Process for making diethyl ether from acetic acid
Methods and apparatus for imaging in conjunction with radiotherapy
Wireless communications system, wireless communications apparatus, wireless communications method and computer program for wireless communication
3D structured memory devices and methods for manufacturing thereof
  Randomly Featured Patents
Actuated tether
Lentiviral vectors
Signaling cable with flexible metallic shielding
Pulse width modulator system
Process for preparing phenolic polymer by using phenothiazines mediator
Methods and apparatus for retrieval of stored articles from a stack
Portion of ferrule for optical fiber connector
Portable work bench having multiple accessories
Swimming goggle
Method and apparatus for penetrating tissue