Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages










Image Number 11 for United States Patent #6462274.

Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.








 
 
  Recently Added Patents
Digital video disc player
Method and apparatus for managing communication services for user endpoint devices
Image forming apparatus
Image forming apparatus
Inspection systems and methods for detecting defects on extreme ultraviolet mask blanks
Context data in UPNP service information
Semiconductor device and method for manufacturing the same
  Randomly Featured Patents
Clipper with lever actuated adjustable comb
Mechanical torque table and method
Refrigerator
Respiration assisting apparatus and method
Steering knuckle and method of forming same
Active matrix display apparatus with drain electrode extensions
Method for the production of components made of ceramic-matrix composite material
Plasma processing method and plasma processing apparatus
Automatic facsimile-receiving-sheet recognizing apparatus
High speed door assembly