Resources Contact Us Home
Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages

Image Number 11 for United States Patent #6462274.

Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.

  Recently Added Patents
Dispensing of restricted goods
Portion of a display panel with an ambiguous facial expression icon
Collaborative image capture
Noise spectrum tracking in noisy acoustical signals
Targeted gene deletions for polysaccharide slime formers
Modular connector for touch sensitive device
Elementary network description for efficient link between neuronal models and neuromorphic systems
  Randomly Featured Patents
System and method for message processing and routing
Sheet feed device having a sheet cassette locking mechanism
Non-tacky adhesive fastening system for use in consumer products
Karman vortex flow meter
Multilayered catalyst for controlled transport of reactant
Floating drive-on dry dock assembly
Triply redundant integrated navigation and asset visibility system
Free-flowing fungal enzyme composition
Interrupt controller and method of accessing interrupts
Facsimile device