Resources Contact Us Home
Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages

Image Number 11 for United States Patent #6462274.

Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.

  Recently Added Patents
Front cover of an electronic device
Removable storage device and method for identifying drive letter of the removable storage device
Plants and seeds of hybrid corn variety CH089600
Wide bandwidth hybrid antenna for combination EAS and RFID label or tag
Location estimation of wireless terminals through pattern matching of deduced signal strengths
Transactional consistency scheme
Optical power measurement method, optical line terminal and optical network unit
  Randomly Featured Patents
Piston rod seal
Nucleic acid and amino acid sequences of infectious salmon anaemia virus and their use as vaccines
Camera having electromagnetic drive source
Lifting jack
Method and device for the production of polytrimethylene terephthalate
Electrical connector
Digital sine/cosine wave generator
Process for preparing aromatic amines
Low complexity detection in digital receivers
Methods and compositions useful in the diagnosis and treatment of autoimmune diseases