Resources Contact Us Home
Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages

Image Number 11 for United States Patent #6462274.

Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.

  Recently Added Patents
Device and method for producing a fluidic connection between cavities
Correction information calculating device, image processing apparatus, image display system, and image correcting method
Asymmetric switching rectifier
Determination of statistical upper bound for estimate of noise power spectral density
Segmenting video based on timestamps in comments
Co-map communication operator
Oral care implement accessory
  Randomly Featured Patents
Imaging sensor
Ankle brace
Herbicidal compositions and herbicidal processes
Striping apparatus for marking surfaces
Method of transmission from TCP/IP communication network to mobile communication network and transmission and reception system therefor
Engineered enhanced inserts for rock drilling bits
Fuzzy logic electronic controller architecture having two section membership function memory
Golf club putter head with face insert
Memory module having interconnected and stacked integrated circuits