Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages










Image Number 11 for United States Patent #6462274.

Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.








 
 
  Recently Added Patents
Clock generator circuit for a charge pump
Universal tablet and smartphone holder
Hydrating lounge chair
Method and device for evaluating evolution of tumoural lesions
Closed cell culture system
Display control device, display control method, and touchpad input system
Jewelry
  Randomly Featured Patents
Method and apparatus for repairing concrete
Dispensing device for radionuclide generators
Arrangement of an impact-sensitive device in a housing
Wound, solid state inductor
Pollen harvesting machine
Multi-part fastening nut, including jam nut
Use of amphiphilic nucleoside phosphonoformic acid derivatives for the treatment of viral infectious diseases
Ferrule transfer method and ferrule holder
Processing servo data having DC level shifts
Detachable carriage drive