Resources Contact Us Home
Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages

Image Number 11 for United States Patent #6462274.

Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.

  Recently Added Patents
Integrated analyses of breast and colorectal cancers
Method, device, and system for configuring component carrier in carrier aggregation scenario
Method of treating lung cancer
Systems and methods for detailed error reporting in data storage systems
Fast carrier allocation in multi-carrier systems
Apparatus and method for extracting cascading style sheet rules
Timing and cell specific system information handling for handover in evolved UTRA
  Randomly Featured Patents
Disk controller response handler for write commands
Pad conditioning disk
Method and apparatus for monitoring and synchronizing user interface events with network data
Electro-optical device and electronic apparatus
Reusable folding shopping list with embedded magnifying lens
Cooking apparatus
Compact, high-temperature, low-flow rate, liquid fuel-fired burner
Reverse osmosis cell with multi-conduit osmotic membrane element
Rotary piston for a rotary piston engine and rotary piston engine
Control device for a brake apparatus