Resources Contact Us Home
Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages

Image Number 11 for United States Patent #6462274.

Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.

  Recently Added Patents
Dynamic association and disassociation of threads to device functions based on requestor identification
Image processing apparatus, method, and storage medium for performing soft proof processing
Transfer formulas
Information distribution system, information distributing method, node, and recording medium
Communication system including a switching section for switching a network route, controlling method and storage medium
High power insulated gate bipolar transistors
  Randomly Featured Patents
Front panel for vending machine
Universal serial bus transmitter
Plasma display panel and plasma display apparatus using the same
Method for virtual adapter destruction on a physical adapter that supports virtual adapters
Transferred electron device pulse train generator
Process for producing confectioners' butter
Corrosion measurement with secondary temperature compensation
Reduced toxicity ethylene glycol-based antifreeze/heat transfer fluid concentrates and antifreeze/heat transfer fluids
Nucleic acid sequence detection employing probes comprising non-nucleosidic coumarin derivatives as polynucleotide-crosslinking agents
Multi-layer adhesives and methods for bonding orthodontic appliances to tooth structure