Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages










Image Number 11 for United States Patent #6462274.

Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.








 
 
  Recently Added Patents
Organic light emitting diode display device and method of fabricating the same
Cartridge for conducting a chemical reaction
Selecting modulation and coding scheme in the presence of interference
Aggregating completion messages in a sideband interface
Signal phase-based location of network nodes
Methods and apparatuses for anti-shading correction with extended color correlated temperature dependency
Waterproof wound protector
  Randomly Featured Patents
Striated flexible sheet material for brush and brush structure thereof
Method for commonly processing two different silver halide color photographic light-sensitive materials
Linear sequencing microprocessor facilitating
Method for reducing surface humps of doped amorphous silicon layer
ATM and POS terminal and method of use thereof
Architecture independent application invocation over a telephony network
Surge protector
Image forming apparatus
Load adjustment device
Air supply control systems for internal combustion engines