Resources Contact Us Home
High-purity copper sputtering targets and thin films

Image Number 2 for United States Patent #6451135.

There is provided copper targets for sputtering capable of forming a deposition film with low electric resistance indispensable for high-speed operation elements and also with excellent thickness uniformity, and such thin copper films. A high-purity copper sputtering target is characterized by comprising up to 0.1 ppm each Na and K, up to 1 ppm each Fe, Ni, Cr, Al, Ca, Mg, up to 5 ppm each carbon and oxygen, up to 1 ppb each U and Th, and, excluding gaseous constituents, more than 99.999% copper. Preferably the average grain size on the sputter surface is 250 .mu.m or below, with its dispersion thin plus or minus 20%. I(111)/I(200) of X-ray diffraction peak intensity on the sputter plane is at least 2.4 with its dispersion within plus or minus 20%.

  Recently Added Patents
Segmentation of a product markup image based on color and color differences
Image forming system, prognosis criterion setting apparatus, prognosis apparatus, image forming apparatus and non-transitory computer-readable recording medium
Signal processing device, signal processing method and program
Method for producing (meth)acrylic anhydride, method for storing (meth)acrylic anhydride, and method for producing (meth)acrylate
Pausing multimedia data streams
Method and system for reduction of decoding complexity in a communication system
  Randomly Featured Patents
Glassware forming machine with cooling system
Coupling for a modular construction system
Printer with audio/video localization
Transition metal catalytic systems and methods for preparing ethylene homopolymers or copolymers of ethylene and .alpha.-olefins using the same
Drill bit sharpening attachment
Process for preparing isomers of salbutamol
System and method for detecting pressure in a subterranean environment
Device to de-spin objects with very high spin
System and method for tree projection for detection of pulmonary embolism
Electronic tone generation system and batons therefor