Resources Contact Us Home
Delay locked loop for use in semiconductor memory device

Image Number 3 for United States Patent #6434062.

It is provided a delay locked loop for obtaining a reduced jitter and a stable time delay adjustment to thereby perform a bi-directional time delay with a small area even at low frequency applications. The delay locked loop includes an input unit for receiving a clock signal and a non-clock signal and comparing received signals to produce an internal clock signal, a controller for receiving the internal clock to produce a control signal, a bi-directional oscillator, responsive to the control signal from the control means, for performing a ring oscillation in a first or second direction and fulfilling an addition and subtraction adjustment function for a time delay, a counter for receiving an output signal of the bi-directional oscillator and counting the number that the signal is passed therethrough, and an AND gate for performing a combination operation on the outputs of the bi-directional oscillating means and the counting means, to produce the result as a final internal clock signal.

  Recently Added Patents
Radiation-emitting semiconductor chip and method for producing a radiation-emitting semiconductor chip
Tungsten barrier and seed for copper filled TSV
Late loading rich media
Ascertaining presentation format based on device primary control determination
Connector with shielding device and method for manufacturing connector
LED-array package
Method of targeting hydrophobic drugs to vascular lesions
  Randomly Featured Patents
Activity toy
Separation device for microparticles involving a magnetic rod
Music playing/processing device and method for playing music file according to playing order of tones
Process for preparation of keystones by oxidation of secondary alcohols using a trimetallic catalyst comprising molybdenum, rhenium and a group VIII noble metal
Disk device
Process and device for determining the refractive index of different mediums
Lipped sealing ring having wax packed in helical grooves to facilitate testing upon installation
Highly integrated single substrate MMW multi-beam sensor
Optical head used in optical information processor