Resources Contact Us Home
Semiconductor package with heat sink having air vent

Image Number 2 for United States Patent #6433420.

A BGA semiconductor package having an embedded heat sink is proposed. The heat sink mounted on a substrate includes a flat portion and supporting members for supporting the flat portion to be positioned above a semiconductor chip. The flat portion is formed with at least one taper air vent for ventilating air in a gap between the flat portion and the chip during a molding process. This further helps prevent voids from forming in an encapsulant due to the air trapped in a molding resin as being flowing slowly through the gap, and avoid the occurrence of a popcorn effect on the encapsulant during a temperature cycle in subsequent processes. As a result, quality and yield for the packaged products can be significantly improved.

  Recently Added Patents
Display screen or portion thereof with icon
Devices including composite thermal capacitors
Apparatus for focus beam analysis of high power lasers
Probe for ultrasound diagnostic apparatus
Puncture resistant fabric
Solar energy converter with improved photovoltaic efficiency, frequency conversion and thermal management permitting super highly concentrated collection
  Randomly Featured Patents
Forward plate compactor
Conveyor retarder
Digital audio disc player
Steering valve
Reconfigurable console reinforcement bracket
Slime remover and slime preventing/removing agent containing a clathrate compound
Amalgam system for electrodeless discharge lamp
Selectively configurable relay
Method of making three-dimensional laminated structures
Versatile plurality mixer with rapid chance lot cycling and locking means