Resources Contact Us Home
Mechanical loading of a land grid array component using a wave spring

Image Number 4 for United States Patent #6430050.

A method and substrate using a wave spring to clamp a component to the substrate. One embodiment of the invention involves a method to use a wave spring to clamp a component to a substrate. The method includes placing the component on the substrate, placing a structure having holes on the component, placing a number of wave springs on a corresponding number of bolts, inserting the bolts into the holes in the structure, and attaching the bolts to the substrate. A second embodiment of the invention involves a substrate with an electrical contact area, an interposer placed on the electrical contact area, a component placed on the interposer, a block having holes placed on the component, bolts and wave springs inserted in the holes, wherein the bolts and wave springs clamp the component, the interposer and the substrate together on the electrical contact area of the substrate.

  Recently Added Patents
Vehicle exterior
Mobile terminal based on W-CDMA system having receive diversity function and system thereof
System for and method of providing single sign-on (SSO) capability in an application publishing environment
Bioactive agent-loaded heart-targeting nanoparticles
Plants and seeds of hybrid corn variety CH367819
Method and system for detecting center pivot collision
Round carrying case
  Randomly Featured Patents
Composite flexure unit
Two-cycle engine
Sterilization of cryogenic liquids by ultrafiltration
Sound monitoring system for sound field selection based on stored microphone data
Portable cement mixer and method
Method of manufacturing a photodiode to have an active region with a convex-lens-shaped surface
Method, a smart card and terminals for effecting transactions through a telecommunication network
Lobe rotor pumps
Methods and apparatus for filling superconductive magnets
Method and device for treatment of varicose veins