Resources Contact Us Home
Semiconductor integrated circuit device and its manufacturing method

Image Number 5 for United States Patent #6429521.

On a semiconductor substrate, there are formed a first macro cell having wiring layers of three layers each formed of a metal wiring layer (for example, an aluminum wiring) and a second macro cell having wiring layers of three layers each formed of a metal wiring layer similar to the first macro cell. The first macro cell is formed to have a wiring structure of three wiring layers though the originally necessary number of metal wiring layers is two. The metal wiring layer of each layer on the first macro cell is formed of the same material as the metal wiring layer of the corresponding each layer on the second macro cell. Moreover, the metal wiring layer of each layer is formed to have the same film thickness. In order to connect the first and second macro cells to each other, a macro interconnection wiring is formed to be included in the third wiring layer (uppermost wiring layer).

  Recently Added Patents
Portable, single member housing cord protector
Barrier layers comprising Ni-inclusive ternary alloys, coated articles including barrier layers, and methods of making the same
Computer system for routing package deliveries
Support member, rotation device comprising such a support and rolling bearing assembly including such a detection device
O-space imaging: highly efficient parallel imaging using complementary nonlinear encoding gradient fields and receive coil geometries
Pressure roller and fixing device equipped with the same
Sending targeted product offerings based on personal information
  Randomly Featured Patents
IC card with metal reinforcing plates and grounding lead wire
Pipe joint
Gate turn-off thyristor
Contacting system for electrical devices
Process for preparing purified 2,6-naphthalenedicarboxylic acid
Method for manufacturing fast bipolar transistors
Connection of a system module to an electronic device
Vehicle door
Optical fiber machining method and end processing device for optical fiber