Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE










Image Number 2 for United States Patent #6426552.

A method for securing two or more semiconductor device components to one another. A hybrid adhesive material, including a pressure sensitive component and a thermoset component, is used to at least temporarily secure the semiconductor device components to each other. The pressure sensitive component of the hybrid adhesive material temporarily secures the semiconductor device components to one another. When the semiconductor device components are properly aligned, the hybrid adhesive material may be heated to cure the thermoset component thereof and to more permanently secure the semiconductor device components to one another. The cure temperature may be lower than about 200.degree. C. and as low as about 120.degree. C. or less. A system for effecting the method of the present invention is also disclosed, as well as semiconductor device assemblies that include the hybrid adhesive material.








 
 
  Recently Added Patents
Sampling switch circuit that uses correlated level shifting
Method and system for providing status of a machine
Tropoelastin derivatives
Hanger
Uni-directional transient voltage suppressor (TVS)
Establishing a graphical user interface (`GUI`) theme
Gaze tracking password input method and device utilizing the same
  Randomly Featured Patents
Work machine
Separable fastener
Rotary shaver
Temples with fragmentary parts of eyeglass frame
Meta data enhanced television programming
Method of measuring the oxygen saturation in pulsating blood flow
Process for producing 2-(halomethyl)phenylacetic acid esters
Batting tee
Process for separating molybdenum and/or other metals contained in residual organic effluents
Process for the preparation of 5,5'-bi-1H-tetrazole salt