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Method for fabrication of high inductance inductors and related structure

Image Number 11 for United States Patent #6417755.

According to various embodiments, a conductor is patterned in a dielectric. The conductor can be patterned, for example, in the shape of a square spiral. The conductor can comprise, for example, copper, aluminum, or copper-aluminum alloy. The dielectric can be, for example, silicon oxide or a low-k dielectric. Trenches are etched next to the patterned conductor in the dielectric. The trenches are filled with a material having a permeability substantially higher than the permeability of the dielectric. The high permeability material can be, for example, nickel, iron, nickel-iron alloy, or magnetic oxide. As a result, an inductor having a high inductance value is achieved without lowering the quality factor of the inductor.

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