Resources Contact Us Home
Method and apparatus for polishing workpiece

Image Number 3 for United States Patent #6328629.

A workpiece such as a semiconductor wafer is held by a top ring, and a lower surface of the workpiece is polished to a flat mirror finish by being pressed against a polishing surface of the turntable while the top ring and the turntable are rotated. While the workpiece is being polished, at least one of the pressure and the flow rate of a fluid which is supplied to an upper surface of the workpiece is detected. When at least one of the detected pressure and the detected flow rate changes, the polishing of the workpiece is stopped.

  Recently Added Patents
Method of processing data and display apparatus for performing the method
Clock distribution circuit
Configurable pitch reducing optical fiber array
Performance apparatus, a method of controlling the performance apparatus and a program recording medium
Shoe outsole with a surface ornamentation contrast
Method of forming a semiconductor package
Once daily formulations of tetracyclines
  Randomly Featured Patents
Plate-type heat exchangers
Pump head
Workflow system, workflow control method and storage medium
Sanitary towel
Low-voltage CMOS space-efficient 15 KV ESD protection for common-mode high-voltage receivers
High critical current superconducting tapes
Physical quantity sensor having multiple through holes
Authorized-user, tag separable, tamper-evident seal with fixed-in-place, reusable catches for thin-walled containers
Apparatus having push/pull actuated boom for generating waves in the ground
Active high frequency transmitter antenna assembly