Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Oxide-bondable solder










Image Number 2 for United States Patent #6319617.

A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. The solder composition exhibits a microstructure containing a solder matrix in which is distributed fine, micron-scale islands of rare-earth-containing intermetallic particles. The existence of the islands makes the rare earth elements better available for bonding, and reduce the extent to which the rare earths are oxidized. Advantageously, the solder contains Au and/or Ag, in which the rare earth elements tend to have some solid solubility. Due to this solubility, the Au and/or Ag tend to provide some additional protection of the rare earths against oxidation, and thereby also provide accelerated dissolution of the rare earth into the molten solder.








 
 
  Recently Added Patents
Semiconductor devices having through electrodes and methods of fabricating the same
Recombinant negative strand virus RNA expression systems and vaccines
Hepatitis C virus inhibitors
Pet bed
Distributed image acquisition, storage, and backup system
Preparation process of transition metal boride and uses thereof
Newly identified human rhinovirus of HRV-C and methods and kits for detecting HRV-Cs
  Randomly Featured Patents
Dental floss holder
Method for manufacturing laminated multilayer electronic components
Gaming device having a symbol covering feature
Window and door casing
User interface for a vehicle installed communication device
Disk queue management for quality of service
Cover sheet for guitar
Method for vacuum brazing aluminum members
Method for making glass
Anomaly detection