Resources Contact Us Home
Heat sink assembly

Image Number 6 for United States Patent #6296048.

A heat sink assembly for an electronics assembly, such as an RF power amplifier, includes a pallet, a fin structure, and a hollow base separate from the fin structure. The fin structure may be an integral curved sheet or a modular apparatus comprising a plurality of inverted U-shaped fin modules. Top horizontal walls of the fin structure directly contact a bottom surface of the pallet. Vertical fins of the fin structure are inserted through the slots of the base. The pallet, fin structure and base are coupled together such that the upper surface of the base applies load to the contact portions of the fin structure sandwiched between the base and the pallet. Methods for assembling a power amplifier and manufacturing a heat sink assembly are also provided.

  Recently Added Patents
Image processor
Location estimation of wireless terminals through pattern matching of deduced signal strengths
Generation, display, and manipulation of measurements in computer graphical designs
Systems and methods for programming an RFID reader
Method and apparatus for detection of the remote origin fraction of radon present in a measuring site
Proximity-based mobile message delivery
Flame-retardant polyamide composition
  Randomly Featured Patents
Fireplace assembly for mobile homes
Chemical vapor deposition of metal chalcogenide films
Underwater exercise apparatus
Medical sensor with modulated encoding scheme
Cosmetic or dermatological use of peptides for promoting adhesion between skin cells
Inverted dispensing pump with vent baffle
Power connector
Liquid dispensing syringe barrel
Apparatus for polishing a substrate at radially varying polish rates
Pacing in the presence of electromagnetic interference