Resources Contact Us Home
Heat sink assembly

Image Number 6 for United States Patent #6296048.

A heat sink assembly for an electronics assembly, such as an RF power amplifier, includes a pallet, a fin structure, and a hollow base separate from the fin structure. The fin structure may be an integral curved sheet or a modular apparatus comprising a plurality of inverted U-shaped fin modules. Top horizontal walls of the fin structure directly contact a bottom surface of the pallet. Vertical fins of the fin structure are inserted through the slots of the base. The pallet, fin structure and base are coupled together such that the upper surface of the base applies load to the contact portions of the fin structure sandwiched between the base and the pallet. Methods for assembling a power amplifier and manufacturing a heat sink assembly are also provided.

  Recently Added Patents
Generating network topology parameters and monitoring a communications network domain
Motor device and method of manufacturing the same
Process for filtering interferograms obtained from SAR images acquired on the same area
Cytokine receptors associated with myelogenous haematological proliferative disorders and uses thereof
Macrocyclic cysteine protease inhibitors and compositions thereof
Scanning optical positioning system with spatially triangulating receivers
Dual use photovoltaic system
  Randomly Featured Patents
Reinforced plastic bag
Detecting electrode and nitrogen oxide sensor using the same
Safety razor
Photographing apparatus with improved white balance correction and method and recording medium
Air blower
Organic light emitting display and fabricating method of the same
Magnetoresistance effect element, and magnetoresistance effect sensor and magnetic information recording and playback system using same
Removable page marker
Mercury wetted switch
Method for preparing silicone rubber particulates coated with metal oxide microparticles