Resources Contact Us Home
Heat sink assembly

Image Number 2 for United States Patent #6296048.

A heat sink assembly for an electronics assembly, such as an RF power amplifier, includes a pallet, a fin structure, and a hollow base separate from the fin structure. The fin structure may be an integral curved sheet or a modular apparatus comprising a plurality of inverted U-shaped fin modules. Top horizontal walls of the fin structure directly contact a bottom surface of the pallet. Vertical fins of the fin structure are inserted through the slots of the base. The pallet, fin structure and base are coupled together such that the upper surface of the base applies load to the contact portions of the fin structure sandwiched between the base and the pallet. Methods for assembling a power amplifier and manufacturing a heat sink assembly are also provided.

  Recently Added Patents
Wafer level packaging structure with large contact area and preparation method thereof
Digital video disc player
Method and apparatus for executing load distributed printing
Methods and apparatus for low power out-of-band communications
Error detection and recovery tool for logical volume management in a data storage system
Lens module and method for manufacturing thereof
Method and system for reduction of decoding complexity in a communication system
  Randomly Featured Patents
Apparatus for detecting focusing state of objective lens
MOS gate Schottky tunnel transistor and an integrated circuit using the same
Durable laminated electronics assembly using epoxy preform
Gear assembly for transmitting rotation between two shafts
Cast-coated paper and production method thereof
Interferometric analysis for the manufacture of nano-scale devices
Process for preparing N-methyl-N'-nitroguanidine
Tapered voltage polysilicon diode electrostatic discharge circuit for power MOSFETs and ICs
Vacuum cleaner hose with an electrical conductor