Resources Contact Us Home
Heat sink assembly

Image Number 2 for United States Patent #6296048.

A heat sink assembly for an electronics assembly, such as an RF power amplifier, includes a pallet, a fin structure, and a hollow base separate from the fin structure. The fin structure may be an integral curved sheet or a modular apparatus comprising a plurality of inverted U-shaped fin modules. Top horizontal walls of the fin structure directly contact a bottom surface of the pallet. Vertical fins of the fin structure are inserted through the slots of the base. The pallet, fin structure and base are coupled together such that the upper surface of the base applies load to the contact portions of the fin structure sandwiched between the base and the pallet. Methods for assembling a power amplifier and manufacturing a heat sink assembly are also provided.

  Recently Added Patents
Method and system for the assignment of security group information using a proxy
Tactile output device for computing device notifications
Gate timing for short servo wedge in disk memory systems
Medical capsule housing formed by thermal welding
Method for correcting integrating cavity effect for calibration and/or characterization targets
Hemostatic devices and methods of making same
  Randomly Featured Patents
Method and system for controlling access to objects in a data processing system based on temporal constraints
Stable and water soluble bis Au(I) complexes and their synthesis
Nucleic acid primers and probes for detecting breast cells
Light-emitting apparatus and illuminating apparatus
Insulated heating container
Stereospecific cis- and trans-vinylic phosphorus esters
Method and arrangement for controlling an internal combustion engine having lean-burn operation
Fill head assembly having membrane for protecting recirculation line
Intelligent power supervisor
Solid-state image pickup element, method of manufacturing the same, and image pickup apparatus including the same