Resources Contact Us Home
Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization

Image Number 7 for United States Patent #6293457.

Form a solder connector on a semiconductor device starting with a first step of forming at least one dielectric layer over a doped semiconductor substrate. Then form a hole through the dielectric layer down to the semiconductor substrate. Form a metal conductor in the hole. Form intermediate layers over the metal conductor and the dielectric layer. Then form a tapered opening down to the surface of the metal conductor. Form BLM layers including a titanium-tungsten (TiW) layer over the metal conductor and the dielectric layer with the remainder of the BLM layers being formed over the TiW layer. Form a mask over the top surface of the BLM layers with a patterning through hole located above the metal conductor exposing a portion of the surface of the BLM layers. Plate a C4 solder bump on the BLM layers in the patterning hole. Remove the mask. Wet etch away the BLM layers aside from the solder bump leaving a residual TiW layer over the dielectric layer. Perform a dry etching process to remove the residual TiW layer aside from the solder bump. Then, end the dry etching when the end point has been reached. Finally, heat the solder bump in a reflow process to form a C4 solder ball.

  Recently Added Patents
Transmission apparatus and network protection method
Cooling structure and cooling method for control rod drive mechanism and nuclear reactor
Performance apparatus, a method of controlling the performance apparatus and a program recording medium
Semiconductor memory apparatus
Nucleic acid sequences encoding strictosidine synthase proteins
Method and CTDevice for computer tomographic spiral scanning of a patient
Interactive program guide systems and processes
  Randomly Featured Patents
Check-in system
Technique for fabrication of a poled electro-optic fiber segment
Fabrication of metal-ceramic composites
Measurement of soil moisture
Circuit and method for automatically regulating the equalization duration when reading a nonvolatile memory
Surface light source device of side light type, liquid crystal display and guide plate
Preparation of olefinically unsaturated compounds, in particular sytrene, by catalytic oxidation
Low-loss control of DC-DC converters in an energy storage system
Ink jet recording apparatus with means for equalizing ink droplet volumes
Fluorescent polarization immunoassay utilizing substituted triazinylaminofluorescein aminoglycosides