Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization










Image Number 7 for United States Patent #6293457.

Form a solder connector on a semiconductor device starting with a first step of forming at least one dielectric layer over a doped semiconductor substrate. Then form a hole through the dielectric layer down to the semiconductor substrate. Form a metal conductor in the hole. Form intermediate layers over the metal conductor and the dielectric layer. Then form a tapered opening down to the surface of the metal conductor. Form BLM layers including a titanium-tungsten (TiW) layer over the metal conductor and the dielectric layer with the remainder of the BLM layers being formed over the TiW layer. Form a mask over the top surface of the BLM layers with a patterning through hole located above the metal conductor exposing a portion of the surface of the BLM layers. Plate a C4 solder bump on the BLM layers in the patterning hole. Remove the mask. Wet etch away the BLM layers aside from the solder bump leaving a residual TiW layer over the dielectric layer. Perform a dry etching process to remove the residual TiW layer aside from the solder bump. Then, end the dry etching when the end point has been reached. Finally, heat the solder bump in a reflow process to form a C4 solder ball.








 
 
  Recently Added Patents
Buffer pool extension for database server
Method, base station and system for adjusting cell wireless configuration parameter
Methods for measuring media performance associated with adjacent track interference
Method and apparatus for content-aware resizing of data chunks for replication
Mobility management in a communications system
Subband SNR correction in a frequency selective scheduler
Intraoral camera for dental chairs
  Randomly Featured Patents
Telecommunications answering feature method and apparatus
Electronic message filtering enhancements
Method for scarfing surface defects of a metal piece
Shock absorber with improved position sensitive assembly
DC-DC converter with integrated transformer assembly composed of transformer pair
Media dispenser
Liquid crystal projector, and projection lens unit, optical unit and cooling system for the same
Copy sheet holddown system
Controller driver and display apparatus
Web transporting apparatus and web cartridges