Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization










Image Number 7 for United States Patent #6293457.

Form a solder connector on a semiconductor device starting with a first step of forming at least one dielectric layer over a doped semiconductor substrate. Then form a hole through the dielectric layer down to the semiconductor substrate. Form a metal conductor in the hole. Form intermediate layers over the metal conductor and the dielectric layer. Then form a tapered opening down to the surface of the metal conductor. Form BLM layers including a titanium-tungsten (TiW) layer over the metal conductor and the dielectric layer with the remainder of the BLM layers being formed over the TiW layer. Form a mask over the top surface of the BLM layers with a patterning through hole located above the metal conductor exposing a portion of the surface of the BLM layers. Plate a C4 solder bump on the BLM layers in the patterning hole. Remove the mask. Wet etch away the BLM layers aside from the solder bump leaving a residual TiW layer over the dielectric layer. Perform a dry etching process to remove the residual TiW layer aside from the solder bump. Then, end the dry etching when the end point has been reached. Finally, heat the solder bump in a reflow process to form a C4 solder ball.








 
 
  Recently Added Patents
Direct sequence spread spectrum predictive cable and component failure technology
Method for texturizing virtual three-dimensional objects
Dental X-ray apparatus and associated method
Brushless electric motor provided with rotor having intermediate magnetic pole
Trench junction field-effect transistor
Spindle motor and disk driving device
Irradiance rigs
  Randomly Featured Patents
Wood glue
Electronic camera
Multi-planar, taper lock screw
Subcutaneous catheter stabilizing devices
Method for the synthesis of substituted formylamines and substituted amines
Electrooptical coupling device
Spiral wound, series fed, array antenna
Asymmetrical field effect transistor
Wall light
Ringing choke converter using single switching element