Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization










Image Number 5 for United States Patent #6293457.

Form a solder connector on a semiconductor device starting with a first step of forming at least one dielectric layer over a doped semiconductor substrate. Then form a hole through the dielectric layer down to the semiconductor substrate. Form a metal conductor in the hole. Form intermediate layers over the metal conductor and the dielectric layer. Then form a tapered opening down to the surface of the metal conductor. Form BLM layers including a titanium-tungsten (TiW) layer over the metal conductor and the dielectric layer with the remainder of the BLM layers being formed over the TiW layer. Form a mask over the top surface of the BLM layers with a patterning through hole located above the metal conductor exposing a portion of the surface of the BLM layers. Plate a C4 solder bump on the BLM layers in the patterning hole. Remove the mask. Wet etch away the BLM layers aside from the solder bump leaving a residual TiW layer over the dielectric layer. Perform a dry etching process to remove the residual TiW layer aside from the solder bump. Then, end the dry etching when the end point has been reached. Finally, heat the solder bump in a reflow process to form a C4 solder ball.








 
 
  Recently Added Patents
Snapshots in de-duplication
Systems and methods for building axes, co-axes and paleo-geographic coordinates related to a stratified geological volume
Bottle
Method and apparatus for monitoring and/or controlling the curing of cements used in medical procedures
Multi-contoured yoga support
Method and system for routing telephony communications together with modified calling party identifier information
Audit planning
  Randomly Featured Patents
Trace module for integrated circuit devices
Antenna apparatus
Method for attenuating oscillations of a rotating system
Receiving device for pedals of a motor vehicle
Techniques for providing storage array services to a cluster of nodes using portal devices
Lamp
Sending personal information to a personal information aggregator
Base for sprinkler
Production of low calorie, extruded, expanded foods having a high fiber content
Antenna mount