Resources Contact Us Home
Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization

Image Number 5 for United States Patent #6293457.

Form a solder connector on a semiconductor device starting with a first step of forming at least one dielectric layer over a doped semiconductor substrate. Then form a hole through the dielectric layer down to the semiconductor substrate. Form a metal conductor in the hole. Form intermediate layers over the metal conductor and the dielectric layer. Then form a tapered opening down to the surface of the metal conductor. Form BLM layers including a titanium-tungsten (TiW) layer over the metal conductor and the dielectric layer with the remainder of the BLM layers being formed over the TiW layer. Form a mask over the top surface of the BLM layers with a patterning through hole located above the metal conductor exposing a portion of the surface of the BLM layers. Plate a C4 solder bump on the BLM layers in the patterning hole. Remove the mask. Wet etch away the BLM layers aside from the solder bump leaving a residual TiW layer over the dielectric layer. Perform a dry etching process to remove the residual TiW layer aside from the solder bump. Then, end the dry etching when the end point has been reached. Finally, heat the solder bump in a reflow process to form a C4 solder ball.

  Recently Added Patents
Remote management of networked systems using secure modular platform
System and method for locating, tracking, and/or monitoring the status of personnel and/or assets both indoors and outdoors
Measuring device and measuring method that use pulsed electromagnetic wave
Optical coherence tomography with multiple sample arms
Ion generation using wetted porous material
Epilation apparatus
System and method for parallel video processing in multicore devices
  Randomly Featured Patents
Information processing apparatus and control method thereof, and program
Sewage treatment tank and tube settler
Three-phase direction-current (DC) brushless motor with hall elements
Differential amplifier with two outputs and a single input of improved linearity
Combined bottle and stopper
Safety device for laser ray guide
Means of mitigating denial of service attacks on IP fragmentation in high performance IPSEC gateways
Disc type recording/reproduction device
Offering incentives under a flat rate charging system
Tear film osmometry