Resources Contact Us Home
Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization

Image Number 3 for United States Patent #6293457.

Form a solder connector on a semiconductor device starting with a first step of forming at least one dielectric layer over a doped semiconductor substrate. Then form a hole through the dielectric layer down to the semiconductor substrate. Form a metal conductor in the hole. Form intermediate layers over the metal conductor and the dielectric layer. Then form a tapered opening down to the surface of the metal conductor. Form BLM layers including a titanium-tungsten (TiW) layer over the metal conductor and the dielectric layer with the remainder of the BLM layers being formed over the TiW layer. Form a mask over the top surface of the BLM layers with a patterning through hole located above the metal conductor exposing a portion of the surface of the BLM layers. Plate a C4 solder bump on the BLM layers in the patterning hole. Remove the mask. Wet etch away the BLM layers aside from the solder bump leaving a residual TiW layer over the dielectric layer. Perform a dry etching process to remove the residual TiW layer aside from the solder bump. Then, end the dry etching when the end point has been reached. Finally, heat the solder bump in a reflow process to form a C4 solder ball.

  Recently Added Patents
Method for growing group III-nitride crystals in supercritical ammonia using an autoclave
Controller for internal combustion engine
Dispensing of restricted goods
Therapeutic compositions and methods
Sitagliptin intermediate compounds, preparation methods and uses thereof
Audio signal clip detection
Error recovery storage along a memory string
  Randomly Featured Patents
Handheld dot printing device
Cleaning roller system and operating method thereof
Method for generating a reference signal sequence using grouping
Nasal oxygen tube support and method
Movable mechanism for using with electrical apparatus to be dissipated
Method for fixing full color toner images
Systems and methods for detecting a loss of electrical connectivity between components of implantable medical lead systems
Buggy with a collapsible frame
Grain-oriented electrical steel sheet and method for manufacturing grain-oriented electrical steel sheet
Swab applicator