Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization










Image Number 3 for United States Patent #6293457.

Form a solder connector on a semiconductor device starting with a first step of forming at least one dielectric layer over a doped semiconductor substrate. Then form a hole through the dielectric layer down to the semiconductor substrate. Form a metal conductor in the hole. Form intermediate layers over the metal conductor and the dielectric layer. Then form a tapered opening down to the surface of the metal conductor. Form BLM layers including a titanium-tungsten (TiW) layer over the metal conductor and the dielectric layer with the remainder of the BLM layers being formed over the TiW layer. Form a mask over the top surface of the BLM layers with a patterning through hole located above the metal conductor exposing a portion of the surface of the BLM layers. Plate a C4 solder bump on the BLM layers in the patterning hole. Remove the mask. Wet etch away the BLM layers aside from the solder bump leaving a residual TiW layer over the dielectric layer. Perform a dry etching process to remove the residual TiW layer aside from the solder bump. Then, end the dry etching when the end point has been reached. Finally, heat the solder bump in a reflow process to form a C4 solder ball.








 
 
  Recently Added Patents
Support for a portable electronic device
Simulation tool for air traffic communications security
Crowd control barrier II
Diaminocyclohexane compounds and uses thereof
Composite aircraft floor system
Method for programming non-volatile memory device and apparatuses performing the method
Coding circuitry for difference-based data transformation
  Randomly Featured Patents
Gemstone
Methods and systems for background color extrapolation
Semiconductor transistor devices and structures with halo regions
Truss jigging/pressing systems
Method and system for involving and operating a remote application within a different system/application in medical imaging
Small wallpack luminaire
Mounting member
Lubricious coating for medical devices
Cement admixture product
Nitride semiconductor light emitting device