Resources Contact Us Home
Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization

Image Number 3 for United States Patent #6293457.

Form a solder connector on a semiconductor device starting with a first step of forming at least one dielectric layer over a doped semiconductor substrate. Then form a hole through the dielectric layer down to the semiconductor substrate. Form a metal conductor in the hole. Form intermediate layers over the metal conductor and the dielectric layer. Then form a tapered opening down to the surface of the metal conductor. Form BLM layers including a titanium-tungsten (TiW) layer over the metal conductor and the dielectric layer with the remainder of the BLM layers being formed over the TiW layer. Form a mask over the top surface of the BLM layers with a patterning through hole located above the metal conductor exposing a portion of the surface of the BLM layers. Plate a C4 solder bump on the BLM layers in the patterning hole. Remove the mask. Wet etch away the BLM layers aside from the solder bump leaving a residual TiW layer over the dielectric layer. Perform a dry etching process to remove the residual TiW layer aside from the solder bump. Then, end the dry etching when the end point has been reached. Finally, heat the solder bump in a reflow process to form a C4 solder ball.

  Recently Added Patents
Input device with photodetector pairs
Image processing apparatus, image processing method, and program
Orthogonal tunable antenna array for wireless communication devices
Visual universal decryption apparatus and methods
Method of and apparatus for evaluating an optimal irradiation amount of an electron beam for drawing a pattern onto a sample
Multi-carrier operation for wireless systems
  Randomly Featured Patents
Color information processing apparatus and method
Apparatus for continuously coating fibers
16-Substituted prostaglandins
Substituted chiral fused [1,2]imidazo[4,5-C] ring compounds
Contacting apparatus for a Si-module
Combination pneumatic hammer, spring and guide for chisels in use for sealing Pittsburgh lock seams
Method and apparatus for distributing routing instructions over multiple interfaces of a data router
Substrate processing method, substrate processing system, and computer-readable storage medium
Indoor navigation method and system using illumination lamps