Resources Contact Us Home
Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization

Image Number 3 for United States Patent #6293457.

Form a solder connector on a semiconductor device starting with a first step of forming at least one dielectric layer over a doped semiconductor substrate. Then form a hole through the dielectric layer down to the semiconductor substrate. Form a metal conductor in the hole. Form intermediate layers over the metal conductor and the dielectric layer. Then form a tapered opening down to the surface of the metal conductor. Form BLM layers including a titanium-tungsten (TiW) layer over the metal conductor and the dielectric layer with the remainder of the BLM layers being formed over the TiW layer. Form a mask over the top surface of the BLM layers with a patterning through hole located above the metal conductor exposing a portion of the surface of the BLM layers. Plate a C4 solder bump on the BLM layers in the patterning hole. Remove the mask. Wet etch away the BLM layers aside from the solder bump leaving a residual TiW layer over the dielectric layer. Perform a dry etching process to remove the residual TiW layer aside from the solder bump. Then, end the dry etching when the end point has been reached. Finally, heat the solder bump in a reflow process to form a C4 solder ball.

  Recently Added Patents
Method and system for detecting data modification within computing device
Co-crystals of agomelatine, a process for there preparation and pharmaceutical compositions containing them
Anti-infective derivatives, method for the production thereof, pharmaceutical compositions containing same and uses of said derivatives in treatment
Mechanical and moisture protection apparatus for electronic devices
Configurable caged ball insert for a downhole tool
Puncture resistant fabric
Verbena plant named `Duempsopicha`
  Randomly Featured Patents
Lossless gate drivers for high-frequency PWM switching cells
Exhaust stack and road tractor exhaust pipe
Tunable microstrip devices
Terminal element for electrical capacitors
Computer having movable shutter selectively providing access to storage media receivers and corresponding operating systems
Method and apparatus for regenerating NOx adsorbers
Production of perhalobenzenes
Isolation and signal filter transformer
Cylindrical mounting apparatus equipped with bracket
Method for producing a wound dressing