Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization










Image Number 3 for United States Patent #6293457.

Form a solder connector on a semiconductor device starting with a first step of forming at least one dielectric layer over a doped semiconductor substrate. Then form a hole through the dielectric layer down to the semiconductor substrate. Form a metal conductor in the hole. Form intermediate layers over the metal conductor and the dielectric layer. Then form a tapered opening down to the surface of the metal conductor. Form BLM layers including a titanium-tungsten (TiW) layer over the metal conductor and the dielectric layer with the remainder of the BLM layers being formed over the TiW layer. Form a mask over the top surface of the BLM layers with a patterning through hole located above the metal conductor exposing a portion of the surface of the BLM layers. Plate a C4 solder bump on the BLM layers in the patterning hole. Remove the mask. Wet etch away the BLM layers aside from the solder bump leaving a residual TiW layer over the dielectric layer. Perform a dry etching process to remove the residual TiW layer aside from the solder bump. Then, end the dry etching when the end point has been reached. Finally, heat the solder bump in a reflow process to form a C4 solder ball.








 
 
  Recently Added Patents
Vehicle and method for controlling vehicle
Method and apparatus for modeling computer program behaviour for behavioural detection of malicious program
Call admission control method and system
Accordion bioreactor
Composite materials comprising aggregate and an elastomeric composition
Method and apparatus for exercise monitoring combining exercise monitoring and visual data with wireless internet connectivity
Method and apparatus for laser strip splicing
  Randomly Featured Patents
Insert for fencing or railing
Amantadine hydrochloride syspension with enhanced dissolution characteristics for use in soft gelatin capsules
Multiple plane weigh platter for multiple plane scanning systems
Quinolinecarboxylic acid derivative, and antibacterial agent containing said compound as active ingredient
Tissue prosthesis processing technology
Coin battery connector
Method and apparatus for visualizing the tile access frequencies for tiled, multi-resolution images
Microfluidic valve and method for controlling the flow of a liquid
Balanced multi-cavity injection molding of like plastic products
Coiling method for wire-shaped rolling stock and coiling device for carrying out the method