Resources Contact Us Home
Coaxial dressing for chemical mechanical polishing

Image Number 3 for United States Patent #6271140.

A polishing apparatus of a semiconductor wafer by a chemical-mechanical polishing method including a polishing platen having an upper surface on which a polishing pad is attached. The polishing platen is rotated in one direction along a central axis. A plurality of coaxial polishing-dressing head assemblies each having a lower surface opposed to an upper surface of the polishing pad on the polishing platen. Each of the coaxial assemblies holds a wafer to be polished while rotating along a central axis and pressing the rotating wafers on a radial portion of the rotating polishing pad. A polishing pad dressing ring is mounted coaxially encircling each of the wafer supporting heads. The applied compression on the wafer supporting heads pushes the wafer and the coaxially mounted dressing ring against the upper surface of the polishing pad therefore polishing each wafer while dressing the polishing pad.

  Recently Added Patents
Fragrance compounds
Vending machine
Mirac proteins
Selected alert delivery in a distributed processing system
Automatic setup of reflector instances
Integrated circuit package system with bonding lands
  Randomly Featured Patents
High impact molding compositions
Compression testing apparatus
Milling machine
Sliding mechanism for device with two keyboards
Vitronectin receptor antagonist pharmaceuticals
Pericardial retractor
Coating apparatus
System and method for using acoustic digital signature generator as oracle
System for attaching colored insert to vehicle frame assembly
Reagent cartridge mixing tube