Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Packaged die PCB with heat sink encapsulant










Image Number 6 for United States Patent #6252308.

An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface ("opposing surface") opposite the surface attached to the substrate to form a wall around a periphery of an opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface for the semiconductor chip.








 
 
  Recently Added Patents
Facial recognition using a sphericity metric
Methods and apparatus for address translation functions
System and method for order placement in an electronic trading environment
Method and system for determining an optimal missile intercept approach direction for correct remote sensor-to-seeker handover
Powerline communication receiver
Self assembly of elements for displays
Method and apparatus for internet on-line insurance policy service
  Randomly Featured Patents
Sub-micrometer gap thermophotovoltaic structure (MTPV) and fabrication method therefor
Interface method and apparatus
X-ray mask and method of fabricating the same
Chassis frame buckling control device and chassis frame deformation control device
Sprinkler nozzle insert tree
Battery pack capable of calculating relative remaining capacity
Creatine oral supplementation using creatine hydrochloride salt
Image forming apparatus having stationary upper unit and pivotable lower unit
Apple tree names `Huaguan`
Electrostatic deflection control circuit and method of electronic beam measuring apparatus