Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Packaged die PCB with heat sink encapsulant










Image Number 6 for United States Patent #6252308.

An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface ("opposing surface") opposite the surface attached to the substrate to form a wall around a periphery of an opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface for the semiconductor chip.








 
 
  Recently Added Patents
Television apparatus
Container
Base station apparatus and method for use in mobile communication system
Digital processing method and system for determination of optical flow
Toner for developing electrostatic charge image, electrostatic charge image developer, toner cartridge, process cartridge, image forming method, and image forming apparatus
Medical device arm
Portable computer
  Randomly Featured Patents
Ophthalmic apparatus
Rigid tonneau cover and clamp mechanism therefor
Voltage level translator circuit
Valve device
Terminal cap and cap attachment structure
Grasping forceps for endoscope
N-[1, (1-1)-dialkyloxy]-and N-[1, (1-1)-dialkenyloxy]-alk-1-yl-n,n,n-tetrasubstituted ammonium lipids and uses therefor
Automatic keno game
Method and system for analyzing various languages and constructing language-independent semantic structures
Process for preparation of control for use in estrogen receptor tests