Resources Contact Us Home
Packaged die PCB with heat sink encapsulant

Image Number 6 for United States Patent #6252308.

An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface ("opposing surface") opposite the surface attached to the substrate to form a wall around a periphery of an opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface for the semiconductor chip.

  Recently Added Patents
Liquid-filled protein-phosphatidic acid capsule dispersions
Medical injector
Electrical installation arrangement
Multibranched polymer and method for producing the same
Method for switching channels in a wireless communication network
Using location based services for determining a calling window
Solid state lighting devices with cellular arrays and associated methods of manufacturing
  Randomly Featured Patents
Flexible tubular device for use in medical applications
Dispensing stick for dispensing substance into a container combined with dispensing lid
Silicon carbide whisker sheet composites
Gas turbine engine geared architecture axial retention arrangement
Electrically configurable connection matrix between lines of at least one input/output port for electrical signals
Method, system, and computer program product for optimizing a database query
Venting end cap for vehicle wheel bearing
Tanning module with a housing
Biomass gasifier