Resources Contact Us Home
Packaged die PCB with heat sink encapsulant

Image Number 6 for United States Patent #6252308.

An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface ("opposing surface") opposite the surface attached to the substrate to form a wall around a periphery of an opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface for the semiconductor chip.

  Recently Added Patents
Memory interface circuit, memory interface method, and electronic device
Data processing apparatus including reconfigurable logic circuit
Method of publicly displaying a person's relationship status
Sense-amplifier monotizer
Interactive program guide systems and processes
Eye therapy system
  Randomly Featured Patents
Code changing method for electronic music instrument with automatic accompaniment function and slur processing
Multi-beam system with beam control using an electrostatic voltage sensor
Client-server electronic program guide
Dual-lumen bi-directional flow catheter
Precursor for alkoxylation catalysts
Cap shoes for cable connector
SCR top connector
Spine assembly
Geranium plant named `Fisblizrose`
Wiring substrate and bonding pad composition