Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Packaged die PCB with heat sink encapsulant










Image Number 6 for United States Patent #6252308.

An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface ("opposing surface") opposite the surface attached to the substrate to form a wall around a periphery of an opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface for the semiconductor chip.








 
 
  Recently Added Patents
Feature management of a communication device
Inductive antenna coupling
Canine iPS cells and method of producing same
Image reconstruction iterative method
Prevention and reduction of blood loss
Resistor-2 resistor (R-2R) digital-to-analog converter with resistor network reversal
Wound dressings
  Randomly Featured Patents
Process for preparing 4-substituted-1H-indole-3-glyoxamides
Process for controlling the rate of growth of particulate masses
Low loss reverse battery protection
Method of measuring specific absorption rate of electromagnetic waves
Container closure
Portable wrench holder
Piezoelectric sensor element with at least two single crystal elements
Automotive chassis
Surface configuration of a vehicle, toy, and/or other replicas
Ski boot with a mechanism for securing a foot instep and heel