Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Packaged die PCB with heat sink encapsulant










Image Number 6 for United States Patent #6252308.

An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface ("opposing surface") opposite the surface attached to the substrate to form a wall around a periphery of an opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface for the semiconductor chip.








 
 
  Recently Added Patents
Data feed management
Method, base station and system for adjusting cell wireless configuration parameter
Communications in an asynchronous cellular wireless network
Image sensor and method for fabricating the same
Interleaving charge pumps for programmable memories
Canopy light fixture
Debugging using code analysis
  Randomly Featured Patents
Portable training toilet
Electrical connector
Semi-automatic welding gun
Compounds that inhibit the interaction between signal-transducing proteins and the GLGF (PDZ/DHR) domain and uses thereof
Powder proof reclosable lid for containers
System for cleaning an inside surface of a duct
Method for the formation of heat mode image
Stair climbing aid
Apparatus and method for the real-time processing of a plurality of tasks
Method and apparatus for backside illuminated image sensors using capacitively coupled readout integrated circuits