Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Packaged die PCB with heat sink encapsulant










Image Number 6 for United States Patent #6252308.

An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface ("opposing surface") opposite the surface attached to the substrate to form a wall around a periphery of an opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface for the semiconductor chip.








 
 
  Recently Added Patents
Analog to digital converter with increased sub-range resolution
Apparatus and method for efficient transmission of acknowledgements
Charged particle beam apparatus
Verifiable service policy implementation for intermediate networking devices
Multibranched polymer and method for producing the same
Voltage regulator structure that is operationally stable for both low and high capacitive loads
Polymers
  Randomly Featured Patents
Method and apparatus for transforming a non-linear lens-distorted image
Electromagnetic wave shielded write and read wires on a support for a magnetic media drive
Adjustment of control strategy based on temperature
Eyeglasses
Wheel lock control system failure and disabling circuit
Hydrosulfite production
Diagonal laminated veneer lumber and method of manufacturing the same
Foldable pocket saw
Transmission device capable of readily controlling active and backup sections
Cosmetic applicators containing heating elements