Resources Contact Us Home
Packaged die PCB with heat sink encapsulant

Image Number 6 for United States Patent #6252308.

An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface ("opposing surface") opposite the surface attached to the substrate to form a wall around a periphery of an opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface for the semiconductor chip.

  Recently Added Patents
Phone messaging using audio streams
Recovering a database to any point-in-time in the past with guaranteed data consistency
Rewarding independent influencers
Distylium plant named `PIIDIST-I`
Display screen with graphical user interface
Field-programmable analog array with memristors
Heterocyclic compounds as CCR2B antagonists
  Randomly Featured Patents
Cutting device, in particular for cutting foodstuffs
Electronic mechanical drum brake
Electrolytes circulation type cell stack secondary battery
Device and method of managing life of toner cartridge, and image forming apparatus using the same
Controlled-unaided surge and purge suppressors for firearm muzzles
Aluminum nitride flakes and spheres
Cellular phone
Plasma display device
Keyboard with versatile switch support structures
Method for making a memory device with plural substrates each having a memory array, a read only memory, and a write state machine