Resources Contact Us Home
Packaged die PCB with heat sink encapsulant

Image Number 5 for United States Patent #6252308.

An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface ("opposing surface") opposite the surface attached to the substrate to form a wall around a periphery of an opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface for the semiconductor chip.

  Recently Added Patents
Maize hybrid X08B748
Platform for generating electricity from flowing fluid using generally prolate turbine
Apparatus for providing location information of hand-held device and method thereof
Pattern forming method using developer containing organic solvent and rinsing solution for use in the pattern forming method
Magnifying glass
Robot control device
  Randomly Featured Patents
Formed disk plate heat exchanger
Electromagnetically actuatable valve
Integrated inertial/GPS navigation system
Method of manufacturing semiconductor device
Low-emission elastomer floor covering
Production of deacetoxycephalosporin C
State-based remote control system
High-efficiency, multilevel, diffractive optical elements
System and method of sampling data within a central processing unit
System and method for differentiating private and shared files within a computer cluster