Resources Contact Us Home
Packaged die PCB with heat sink encapsulant

Image Number 5 for United States Patent #6252308.

An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface ("opposing surface") opposite the surface attached to the substrate to form a wall around a periphery of an opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface for the semiconductor chip.

  Recently Added Patents
Device for installing conducting components in structures
Can seam inspection
Device for accurately measuring concentration of component in blood and control method of the device
Device for increasing chip testing efficiency and method thereof
Additives for oil recovery from reservoirs
Virtual links in a routed ethernet mesh network
Method for driving bistable display device
  Randomly Featured Patents
Lockup control system for automatic transmissions
Hyperbaric oxygen therapy system controls
Method and apparatus for data retrieval
Cover plate assembly
Jib having two adjustable elements
Convertible diaper/pant with ease of application
Micrometer gauge
Imagine apparatus with rotatable lens barrel
Bidirectional printing method in accordance with vertical breaks
Image processing apparatus