Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Packaged die PCB with heat sink encapsulant










Image Number 5 for United States Patent #6252308.

An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface ("opposing surface") opposite the surface attached to the substrate to form a wall around a periphery of an opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface for the semiconductor chip.








 
 
  Recently Added Patents
Magnetic memory and method of manufacturing the same
Image capturing apparatus, control method thereof, and program
Pandemic protocol for emergency dispatch
Method and apparatus for band switching in wireless local access network
System and method for managing content on a network interface
Electric power supply system and electric power supply system for motor vehicle
Fuel cell module
  Randomly Featured Patents
Spare tire tuned mass damper
Powerline network bridging congestion control
Adhesion promoters
Manufacture of spheroidal alumina particles
Anode material and battery using the same
Dogging device for a latch assembly
Front face of a vehicle wheel
Method of sintering pellets
Vacuum filtration apparatus
Document image filing system having input color mode selecting capability