Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Packaged die PCB with heat sink encapsulant










Image Number 5 for United States Patent #6252308.

An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface ("opposing surface") opposite the surface attached to the substrate to form a wall around a periphery of an opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface for the semiconductor chip.








 
 
  Recently Added Patents
Electronic component
Reading apparatus and reading method
Navigating applications using side-mounted touchpad
Use of natural query events to improve online advertising campaigns
Expressive grouping for language integrated queries
Isolated Australian coral reef fluorescent proteins and cell-based kinase or phosphatase platforms for cancer drug development
Display screen or portion thereof with graphical user interface
  Randomly Featured Patents
Battery warmer
Adherent rubber composition for steel cord
Hot roll fuser temperature control
Installing posture parameter auto extracting method of imaging device, and monitoring system using the imaging device
Floating head magnetic disk recording and/or reproducing apparatus
Stretch wrap machine with top corner film transfer
High-frequency oscillator-inverter ballast circuit for discharge lamps
Photographic element containing a red dye-forming pyrazolotriazole coupler
Testing circuitry of internal peripheral blocks in a semiconductor memory device and method of testing the same
Method for assembling two-way transmission gears with power distribution