Resources Contact Us Home
Packaged die PCB with heat sink encapsulant

Image Number 5 for United States Patent #6252308.

An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface ("opposing surface") opposite the surface attached to the substrate to form a wall around a periphery of an opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface for the semiconductor chip.

  Recently Added Patents
Idle stop and go system and method for controlling thereof
Debugging using code analysis
Mobile communication device monitoring systems and methods
Segmenting video based on timestamps in comments
Method of analyzing cell structures and their components
Method for producing semiconductor substrate, semiconductor substrate, method for manufacturing electronic device, and reaction apparatus
Method and apparatus for soft information transfer between constituent processor circuits in a soft-value processing apparatus
  Randomly Featured Patents
Prefabricated furniture system
Method for evaluating a measured parameter
Optical system for direct imaging of light markable material
Fluid pressure responsive electric switch
Nucleic acids encoding antibodies that bind interleukin-4 receptor
Rotor bearing for submersible pump motor
Container assembly for flowable materials
Multistatic antenna configuration for radio frequency identification (RFID) systems
Stepping motor drive device and method
Production process for catalyst