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3 point vacuum chuck with non-resilient support members

Image Number 4 for United States Patent #6196532.

The present invention generally provides a workpiece handling device and, more particularly, a vacuum operated chuck for securing a substrate to a substrate handling device. In one embodiment, the invention provides a chuck having three vacuum chuck rings projecting from a chuck base and having no resilient materials such as o-rings or the like exposed to the operating environment within which the wafer is being handled. In another embodiment, the present invention provides a substrate handling chuck having removable vacuum chuck rings for permitting interchangeable chuck ring elements for a particular application.

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