Resources Contact Us Home
Method and apparatus for performing a circuit edit through the back side of an integrated circuit die

Image Number 19 for United States Patent #6150718.

A method and an apparatus for performing circuit edits through the back side of a flip-chip packaged integrated circuit die. In one embodiment, a circuit edit is achieved by exposing first and second circuit edit connection targets through a semiconductor substrate of the integrated circuit die from the back side. Next, an insulating layer is deposited over the first and second circuit edit connection targets and the exposed semiconductor substrate. Next, the circuit edit connection targets are re-exposed through the insulating layer and a conductor is deposited over the re-exposed circuit edit connection targets and the deposited insulating layer from the back side of the integrated circuit to couple together the circuit edit connection targets.

  Recently Added Patents
Haworthia plant named `CAPETOWN`
Ink composition, ink for inkjet recording and ink set using the ink
Controlling a video window position relative to a video camera position
Interleaving charge pumps for programmable memories
Alternate source programming
Pyrrolidine-1,2-dicarboxamide derivatives
High-order harmonic device of cavity filter
  Randomly Featured Patents
Pressure cooker
Thin epitaxy resurf integrated circuit containing high voltage p-channel and n-channel devices with source or drain not tied to ground
Conserving memory by using objects that are selectably mutable during runtime
Aperture stop for a photometry unit of a camera
Levelling apparatus for AC elevator
Pyridinium salts
MIMO communication system having deterministic channels and antenna arrangement method therfor
Warp knitting loom, in particular crochet galloon machine
Downhole power generation
Association unit, association apparatus and method for the same