Resources Contact Us Home
Method and apparatus for performing a circuit edit through the back side of an integrated circuit die

Image Number 19 for United States Patent #6150718.

A method and an apparatus for performing circuit edits through the back side of a flip-chip packaged integrated circuit die. In one embodiment, a circuit edit is achieved by exposing first and second circuit edit connection targets through a semiconductor substrate of the integrated circuit die from the back side. Next, an insulating layer is deposited over the first and second circuit edit connection targets and the exposed semiconductor substrate. Next, the circuit edit connection targets are re-exposed through the insulating layer and a conductor is deposited over the re-exposed circuit edit connection targets and the deposited insulating layer from the back side of the integrated circuit to couple together the circuit edit connection targets.

  Recently Added Patents
Multicyclic compounds and methods of use thereof
Medicament container
Frame syncrhonization in orthogonal frequency-division multiplexing systems
Data-conditioned encryption method
Solid-state imaging device
Use of emerging non-volatile memory elements with flash memory
Traffic flow analysis mitigation using a cover signal
  Randomly Featured Patents
Shaving apparatus
Modular ceramic electrochemical apparatus and method of manufacture therefor
Antibacterial agents
Starch ester release coatings
Fetal lung maturation tester
Fishing tool
Valve with lip seal
Psychotropic deuterated derivatives of phenylhydantoin and pharmaceutical compositions comprising such derivatives
Cosmetic container
Infrared bolometer