Resources Contact Us Home
Method and apparatus for performing a circuit edit through the back side of an integrated circuit die

Image Number 19 for United States Patent #6150718.

A method and an apparatus for performing circuit edits through the back side of a flip-chip packaged integrated circuit die. In one embodiment, a circuit edit is achieved by exposing first and second circuit edit connection targets through a semiconductor substrate of the integrated circuit die from the back side. Next, an insulating layer is deposited over the first and second circuit edit connection targets and the exposed semiconductor substrate. Next, the circuit edit connection targets are re-exposed through the insulating layer and a conductor is deposited over the re-exposed circuit edit connection targets and the deposited insulating layer from the back side of the integrated circuit to couple together the circuit edit connection targets.

  Recently Added Patents
High performance adaptive switched LED driver
Method and apparatus for belling plastic pipe
Current collector for lead acid battery
Multi charged particle beam writing apparatus and multi charged particle beam writing method
Scalable security services for multicast in a router having integrated zone-based firewall
Planarizing agents and devices
Caching techniques
  Randomly Featured Patents
Negative resist composition and patterning process using the same
Electronic accounting-document system, electronic accounting-document processing method, accounting-document creation unit, and accounting-document processing unit
System and method for clock switching
Anisotropic magnetic powder and magnet thereof and method of producing same
Digital transmitter utilizing a phase shifter having decoupled coplanar microstrips
Process for conditioning a gas-phase reactor to produce an ethylene-propylene or ethylene-propylene-diene rubber
Gateway for supporting communications between network devices of different private networks
Economical weighing apparatus employing a cantilever beam structure
Light emitting panel assemblies
Semiconductor device and method of manufacturing the same