Resources Contact Us Home
Method and apparatus for performing a circuit edit through the back side of an integrated circuit die

Image Number 19 for United States Patent #6150718.

A method and an apparatus for performing circuit edits through the back side of a flip-chip packaged integrated circuit die. In one embodiment, a circuit edit is achieved by exposing first and second circuit edit connection targets through a semiconductor substrate of the integrated circuit die from the back side. Next, an insulating layer is deposited over the first and second circuit edit connection targets and the exposed semiconductor substrate. Next, the circuit edit connection targets are re-exposed through the insulating layer and a conductor is deposited over the re-exposed circuit edit connection targets and the deposited insulating layer from the back side of the integrated circuit to couple together the circuit edit connection targets.

  Recently Added Patents
Method for the analysis of solid objects
Filler containing composition and process for production and use thereof
Human embryonic stem cell methods and PODXL expression
Pulsed plasma with low wafer temperature for ultra thin layer etches
Ventilated vacuum commutation structure
Method for isomerisation of hop alpha-acids using heterogeneous alkaline earth metal based catalysts
Method and apparatus for controlling the use of data stored on a media sample
  Randomly Featured Patents
Optimized caching of SQL data in an object server system
Pharmaceutical tablet
Control of illumination devices
Plasma display apparatus and driving method thereof
Gas retarded blowback operating system for pistols and other short barreled weapons
Camera system, control method, communication terminal, and program storage media, for selectively authorizing remote map display
Television receiver
Process for preparing cephalexin monohydrate
Brake system
Computer security system