Resources Contact Us Home
Method and apparatus for performing a circuit edit through the back side of an integrated circuit die

Image Number 19 for United States Patent #6150718.

A method and an apparatus for performing circuit edits through the back side of a flip-chip packaged integrated circuit die. In one embodiment, a circuit edit is achieved by exposing first and second circuit edit connection targets through a semiconductor substrate of the integrated circuit die from the back side. Next, an insulating layer is deposited over the first and second circuit edit connection targets and the exposed semiconductor substrate. Next, the circuit edit connection targets are re-exposed through the insulating layer and a conductor is deposited over the re-exposed circuit edit connection targets and the deposited insulating layer from the back side of the integrated circuit to couple together the circuit edit connection targets.

  Recently Added Patents
Location-based method to specify ratio frequency spectrum rights
Fuel cell with air channel actuator
Programming method of non-volatile memory device
Method for forming contact in an integrated circuit
In-store marketing sign
Mirror drift compensation in an optical circuit switch
Liquid crystal display device
  Randomly Featured Patents
Device for producing a three-dimensional object, especially a laser sintering machine
Catalyst systems and polymerization processes
Conductive sheet with non-connection portion
Substrate holding device and substrate processing apparatus
Polyoxymethylene molding materials and moldings and the use thereof
Optical packet-switched transmission network
Compartmented fuel tank with fuel absorbent material
Electric motor end play control
Multilayer recording medium and optical pickup for recording and/or reproducing the same
Modulation ignition system