Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method and apparatus for performing a circuit edit through the back side of an integrated circuit die










Image Number 19 for United States Patent #6150718.

A method and an apparatus for performing circuit edits through the back side of a flip-chip packaged integrated circuit die. In one embodiment, a circuit edit is achieved by exposing first and second circuit edit connection targets through a semiconductor substrate of the integrated circuit die from the back side. Next, an insulating layer is deposited over the first and second circuit edit connection targets and the exposed semiconductor substrate. Next, the circuit edit connection targets are re-exposed through the insulating layer and a conductor is deposited over the re-exposed circuit edit connection targets and the deposited insulating layer from the back side of the integrated circuit to couple together the circuit edit connection targets.








 
 
  Recently Added Patents
Frequency offset estimation apparatus and method of OFDM system
Automatic adjustment of devices in a home entertainment system
Image forming apparatus
Potential separation for filling level radar
System and method of error reporting in a video distribution network
Catalyst composition with nanometer crystallites for slurry hydrocracking
Method of and apparatus for evaluating an optimal irradiation amount of an electron beam for drawing a pattern onto a sample
  Randomly Featured Patents
Brake rotor
Gaming device method and apparatus employing modified payouts
Processes for the recovery of naturally produced chymosin
Connector housing with housing cover
Blow molded container with improved neck with locking teeth and method for forming same
Fabrication process for embedding optical band gap structures in a low temperature co-fired ceramic substrate
Method and apparatus for transmitting signals for multiple input multiple output wireless communication system
Method for the electrodeposition of hydroxyapatite layers
Combined tube and cap
Method of making secure collaboration between objects of an object-oriented program