Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Transfer molded PCMCIA standard cards Image Number 3 for United States Patent #6128195. A transfer molded PC card standard or small form factor card electronic package includes a substrate that has an integrated circuit package thereon and an electrical connector along a side of the substrate. In addition, an upper cover extends over at least a portion of the substrate and the electrical connector. A lower cover extends over at least a portion of the substrate and the electrical connector and a transfer molded encapsulant covers the substrate and a portion of the upper cover and the lower cover. The portion of the upper cover and the lower cover are covered by the encapsulant and includes a first flange attached to a portion of a periphery of the upper cover and a second flange that is attached to a portion of the periphery of the lower cover.       Recently Added Patents Thermosensitive recording medium Multifunction switch for vehicle having lighting module System and method for predicting remaining useful life of device components Personalized health communication system Image surveillance system and method of detecting whether object is left behind or taken away Delay interferometer using magneto-optic effect of a variable faraday rotator Method for manufacturing non-volatile memory device, non-volatile memory element, and non-volatile memory device   Randomly Featured Patents Shoe sole Lens manufacturing method thereof, and optical pickup Processing CDMA signals Method for forming resist pattern Automatic change of symmetrical encryption key Method and system for multirate multiuser modulation Pyroelectric energy converter and method Cover for therapeutic support cushion Physical sensor component Vacuum water making method and device thereof © 2006-2008 PatentGenius. All Rights Reserved.