Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Transfer molded PCMCIA standard cards Image Number 3 for United States Patent #6128195. A transfer molded PC card standard or small form factor card electronic package includes a substrate that has an integrated circuit package thereon and an electrical connector along a side of the substrate. In addition, an upper cover extends over at least a portion of the substrate and the electrical connector. A lower cover extends over at least a portion of the substrate and the electrical connector and a transfer molded encapsulant covers the substrate and a portion of the upper cover and the lower cover. The portion of the upper cover and the lower cover are covered by the encapsulant and includes a first flange attached to a portion of a periphery of the upper cover and a second flange that is attached to a portion of the periphery of the lower cover.       Recently Added Patents Foldable fixing apparatus for hard disk drive Input device Apparatus, method, and system for identifying laser spot Polymer electrolyte membrane, and membrane electrode assembly and polymer electrolyte fuel cell using the same Set of mahjong Multiple gear motor drive Key labeling method   Randomly Featured Patents Hair treatment composition Auxiliary sun shield for a front windshield visor Universal digital frequency synthesizer using single side band techniques Longitudinal film stretcher especially for thermoplastic film Electromagnetic radiation frequency optimizing device and method Methods and systems for managing reconciliation and write-off in an accrual accounting environment Manifold inputs and outputs for furnace regenerators Method and device for subaqueous ultrasonic irradiation of living tissue Radial polymers prepared by stabilized free radical polymerization Implement for ground treatment with a dead-man safety © 2006-2008 PatentGenius. All Rights Reserved.