Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Transfer molded PCMCIA standard cards Image Number 3 for United States Patent #6128195. A transfer molded PC card standard or small form factor card electronic package includes a substrate that has an integrated circuit package thereon and an electrical connector along a side of the substrate. In addition, an upper cover extends over at least a portion of the substrate and the electrical connector. A lower cover extends over at least a portion of the substrate and the electrical connector and a transfer molded encapsulant covers the substrate and a portion of the upper cover and the lower cover. The portion of the upper cover and the lower cover are covered by the encapsulant and includes a first flange attached to a portion of a periphery of the upper cover and a second flange that is attached to a portion of the periphery of the lower cover.       Recently Added Patents Ion trap for cooling ions Gray balance calibration in an image printing system Methods for modifying vascular vessel walls Substituted bipyridyl compound and organic electroluminescent device Local biomechanical and/or antimicrobial ligation device 3D display panel and method for manufacturing the same Lighting fixture lens   Randomly Featured Patents Powered wet-shaving razor Antenna array with system for locating and adjusting phase centers of elements of the antenna array Apparatus for removing volatiles from, or dehydrating, liquid products Golf club head Multiple use billiard ball rack Flexible joint for a culvert Method of memory error correction by scrubbing Embossed fabric Oxygen-scavenging containers Valve © 2006-2008 PatentGenius. All Rights Reserved.