Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Transfer molded PCMCIA standard cards Image Number 3 for United States Patent #6128195. A transfer molded PC card standard or small form factor card electronic package includes a substrate that has an integrated circuit package thereon and an electrical connector along a side of the substrate. In addition, an upper cover extends over at least a portion of the substrate and the electrical connector. A lower cover extends over at least a portion of the substrate and the electrical connector and a transfer molded encapsulant covers the substrate and a portion of the upper cover and the lower cover. The portion of the upper cover and the lower cover are covered by the encapsulant and includes a first flange attached to a portion of a periphery of the upper cover and a second flange that is attached to a portion of the periphery of the lower cover.       Recently Added Patents Formation of an optical waveguide Real-time demand prediction in a fast service restaurant environment Horizontal card holder Microcapsules, their use and processes for their manufacture Wind turbine Controlling transmission resources in mobile radio systems with dualtransfer mode Systems and methods for selective text to speech synthesis   Randomly Featured Patents Semiconductor device and method for manufacturing the same Use of CSF-1 to treat bacterial infections Organic thin film transistor and process for manufacturing same Drive control unit for an ultrasonic step motor Rotor body and production method thereof Fuel tank filler tube closure assembly Microphone Dustpan apparatus Email system automatically notifying sender status and routing information during delivery Method and apparatus for protecting a hose © 2006-2008 PatentGenius. All Rights Reserved.