Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Transfer molded PCMCIA standard cards










Image Number 3 for United States Patent #6128195.

A transfer molded PC card standard or small form factor card electronic package includes a substrate that has an integrated circuit package thereon and an electrical connector along a side of the substrate. In addition, an upper cover extends over at least a portion of the substrate and the electrical connector. A lower cover extends over at least a portion of the substrate and the electrical connector and a transfer molded encapsulant covers the substrate and a portion of the upper cover and the lower cover. The portion of the upper cover and the lower cover are covered by the encapsulant and includes a first flange attached to a portion of a periphery of the upper cover and a second flange that is attached to a portion of the periphery of the lower cover.








 
 
  Recently Added Patents
Polyfunctional sulfur-containing epoxies and compositions thereof
Methods and apparatuses for configuring and operating graphics processing units
Toy
Method and structure for forming ETSOI capacitors, diodes, resistors and back gate contacts
System for determining potential lot consolidation during manufacturing
Methods for fabricating semiconductor devices
Data processor and scanner device
  Randomly Featured Patents
Egg collector
Dispensing tip and cap
Method for modeling an arbitrary well path in a hydrocarbon reservoir using adaptive meshing
Strains of Streptomyces and relevant uses thereof
Communication system, apparatus, and method in which data transmission is interrupted for a bus reset
Polynucleotide constructs, pharmaceutical compositions and methods for targeted downregulation of angiogenesis and anticancer therapy
Heat-sealable plastic films
Polymeric compositions and processes for providing weatherable film and sheet
Article storage rack
Content viewing system, content viewing apparatus, and viewing approval apparatus