Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Transfer molded PCMCIA standard cards










Image Number 3 for United States Patent #6128195.

A transfer molded PC card standard or small form factor card electronic package includes a substrate that has an integrated circuit package thereon and an electrical connector along a side of the substrate. In addition, an upper cover extends over at least a portion of the substrate and the electrical connector. A lower cover extends over at least a portion of the substrate and the electrical connector and a transfer molded encapsulant covers the substrate and a portion of the upper cover and the lower cover. The portion of the upper cover and the lower cover are covered by the encapsulant and includes a first flange attached to a portion of a periphery of the upper cover and a second flange that is attached to a portion of the periphery of the lower cover.








 
 
  Recently Added Patents
Operation controlling apparatus
Organic light emitting diode device and fabrication method thereof
Compact ion accelerator source
Method for detecting motion of an electrical device or apparatus
Photoacoustic joulemeter utilizing beam deflection technique
Inductive antenna coupling
Method for identifying bacteria in a sample
  Randomly Featured Patents
Rivet tool escapement mechanism
Regulator circuit
Flow control valve
Tape caddy
Composition for electron emitter of field emission display and method for producing electron emitter using the same
Control station for pressurized gases
Stator coil T-connection for two-phase step motors
Cyclohexylamines
Robot blade with dual offset wafer supports
Image formation system, image formation device, server device and program