Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Transfer molded PCMCIA standard cards










Image Number 3 for United States Patent #6128195.

A transfer molded PC card standard or small form factor card electronic package includes a substrate that has an integrated circuit package thereon and an electrical connector along a side of the substrate. In addition, an upper cover extends over at least a portion of the substrate and the electrical connector. A lower cover extends over at least a portion of the substrate and the electrical connector and a transfer molded encapsulant covers the substrate and a portion of the upper cover and the lower cover. The portion of the upper cover and the lower cover are covered by the encapsulant and includes a first flange attached to a portion of a periphery of the upper cover and a second flange that is attached to a portion of the periphery of the lower cover.








 
 
  Recently Added Patents
Analog-to-digital converter with input voltage biasing DC level of resonant oscillator
Array substrate including thin film transistor and method of fabricating the same
Photoelectric conversion apparatus
3D solid-state arrangement for solid state memory
System and method for controlling device location determination
Method and system for tracking mobile electronic devices while conserving cellular network resources
Display screen or portion thereof with graphical user interface
  Randomly Featured Patents
Automatic pipette or the like
Flexible annular stapler for closed surgery of hollow organs
Thermally processable imaging element having a crosslinked hydrophobic binder
Cement screed tool
Glitchless switched-capacitor biquad low pass filter
Dust filtration system
Electronic apparatus having dual-mode load circuit
Fire-retardant low-density epoxy composition
Pushing assembly for data storage device
Method for automatically changing current ranges