Image Number 2 for United States Patent #6086731.
A composite plating apparatus includes a cylindrical electrode which is positioned in a hollow section of a workpiece with a surrounding gap left therebetween. A plurality of through-holes are formed across the thickness of an outer wall of the cylindrical electrode. Composite plating liquid is jetted out through the through-holes and impinge on the inner surface of the hollow section to thereby produce turbulence. The turbulent liquid provides a uniform distribution of ceramic particles in the liquid. As a result, the ceramic particles can be co-deposited uniformly in a metallic matrix, and hence a uniform abrasion-resistant characteristic is obtained all over a resultant composite plating film.