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Image Number 4 for United States Patent #6079874.
An apparatus accurately measures a temperature of a substrate in a thermal processing chamber. The apparatus has a support structure to support the substrate within the thermal processing chamber. A first probe is provided with an input end positioned to receive radiation from the substrate during thermal processing. A second probe is also provided with an input end positioned to receive radiation from the substrate during thermal processing. The second probe is positioned such that it is angularly offset from the first probe so radiation provided at an output end of the second probe is out of phase with radiation provided at the output end of the first probe. A junction receives and combines radiation from the output ends of the first and second probes. The radiation is combined to provide an accurate representation of the temperature of a local region of the substrate by compensating for a temperature gradient between the support structure and the substrate.
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