Resources Contact Us Home
Semiconductor device and fabrication method

Image Number 4 for United States Patent #6051877.

A thin-film semiconductor device comprising at least a semiconductor element and a wiring is disclosed. A thin film of a protective insulating material is formed on the lower surface of the semiconductor element, and a substrate is bonded on the lower surface of the thin film. A method for fabricating the thin-film semiconductor device is also disclosed, in which a thin-film semiconductor circuit is formed on a silicon-on-insulator wafer, the silicon substrate on the reverse side of the silicon-on-insulator wafer is etched off, a thin-film semiconductor chip is formed and attached to the substrate, and the thin-film semiconductor chip and the substrate are wired to each other by printing.

  Recently Added Patents
Lateral flow test kit and method for detecting an analyte
Provision of downlink packet access services to user equipment in spread spectrum communication network
Image capture system and method
Hydroxyl-terminated thiocarbonate containing compounds, polymers, and copolymers, and polyurethanes and urethane acrylics made therefrom
Method for automatically estimating inertia in a mechanical system
Method and device for managing devices in device management system
Terminal device and image printing method
  Randomly Featured Patents
Current sense circuit with fast response
Deskewing differential repeater
Greeting card having removable decal section
Heteroaryl alkyl alpha substituted peptidylamine calcium channel blockers
Map display apparatus
Differential pair geometry for integrated circuit chip packages
Telecommunications network subscriber experience measurement
Steering mechanism for a toy vehicle
Milling cutter with adjustable finishing insert
Catheter system