Resources Contact Us Home
Semiconductor device and fabrication method

Image Number 10 for United States Patent #6051877.

A thin-film semiconductor device comprising at least a semiconductor element and a wiring is disclosed. A thin film of a protective insulating material is formed on the lower surface of the semiconductor element, and a substrate is bonded on the lower surface of the thin film. A method for fabricating the thin-film semiconductor device is also disclosed, in which a thin-film semiconductor circuit is formed on a silicon-on-insulator wafer, the silicon substrate on the reverse side of the silicon-on-insulator wafer is etched off, a thin-film semiconductor chip is formed and attached to the substrate, and the thin-film semiconductor chip and the substrate are wired to each other by printing.

  Recently Added Patents
System and method for data reconfiguration in an optical communication network
System, method, and computer program product for determining whether an electronic mail message is compliant with an etiquette policy
Systems and/or methods for determining item serial number structure and intelligence
Fixing device, fixing device control method, and image forming apparatus
Fast base station switching method and system, and hierarchical zone-based fast handoff approach
Method and apparatus for laser strip splicing
Method of driving stereoscopic display apparatus and stereoscopic display apparatus
  Randomly Featured Patents
Electromagnetic clutch apparatus
Device for cutting an electrode casing
Semiconductor memory device with discriminator for diagnostic mode of operation
Screen for deterring flying insects
System for individual and remote control of spaced lighting fixtures
Diodes with quantum-wave interference layers
.alpha.-haloenamine reagents
Flame retardant polypropylene resin composition
Virtually addressed cache
Method and apparatus for cancelling noise in a received signal by signal subtraction